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Beyne, E.
169  Ergebnisse:
Personensuche X
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1

Modeling-Based Improvement of Micro-Scale Liquid Jet Imping..:

Elsinger, G. ; Oprins, H. ; Cherman, V....
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
Link: https://doi.org/10.1109/..
 
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2

Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Inte..:

Nagano, F. ; Inoue, F. ; Phommahaxay, A....
ECS Journal of Solid State Science and Technology.  12 (2023)  3 - p. 033002 , 2023
Link: https://doi.org/10.1149/..
 
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3

FUTPRINT50 Academy – Aircraft Design Challenge 2022: Develo..:

Eissele, J ; Lafer, S ; Mejía-Burbano, C...
Journal of Physics: Conference Series.  2526 (2023)  1 - p. 012020 , 2023
Link: https://doi.org/10.1088/..
 
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4

Backside Power Delivery: Game Changer and Key Enabler of Ad..:

, In: 2023 International Electron Devices Meeting (IEDM),
Veloso, A. ; Vermeersch, B. ; Chen, R.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Analysis of warpage of a flip-chip BGA package under therma..:

Salahouelhadj, A. ; Gonzalez, M. ; Vanstreels, K....
Microelectronic Engineering.  271-272 (2023)  - p. 111947 , 2023
Link: https://doi.org/10.1016/..
 
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6

Micro-Scale Jet Cooling: A Numerical Study on Improvement O..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Elsinger, G. ; Oprins, H. ; Cherman, V.... - p. 1-10 , 2023
Link: https://doi.org/10.1109/..
 
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7

Liquid jet impingement cooling of high-performance interpos..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Oprins, H. ; Wei, Tiwei ; Cherman, Vladimir. - p. 1-10 , 2023
Link: https://doi.org/10.1109/..
 
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8

(Why do we need) Wireless Heterogeneous Integration (anyway..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Peeters, M. ; Sinha, S. ; Sun, X.... - p. 256-257 , 2022
Link: https://doi.org/10.1109/..
 
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9

Scaled FinFETs Connected by Using Both Wafer Sides for Rout..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Veloso, A. ; Jourdain, A. ; Radisic, D.... - p. 284-285 , 2022
Link: https://doi.org/10.1109/..
 
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10

Investigating moisture diffusion in Mold Compounds (MCs) fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Salahouelhadj, A. ; Gonzalez, M. ; Podpod, A.. - p. 1704-1710 , 2022
Link: https://doi.org/10.1109/..
 
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11

Insights into Scaled Logic Devices Connected from Both Wafe..:

, In: 2022 International Electron Devices Meeting (IEDM),
Veloso, A. ; Eneman, G. ; Matagne, P.... - p. 23.3.1-23.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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12

Enabling Active Backside Technology for ESD and LU Reliabil..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Serbulova, K. ; Chen, S.-H. ; Hellings, G.... - p. 431-432 , 2022
Link: https://doi.org/10.1109/..
 
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13

Power, Performance, Area and Thermal Analysis of 2D and 3D ..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chen, R. ; Lofrano, M. ; Mirabelli, G.... - p. 23.4.1-23.4.4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs ..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chen, R. ; Sisto, G. ; Stucchi, M.... - p. 429-430 , 2022
Link: https://doi.org/10.1109/..
 
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15

Void Formation Mechanism Related to Particles During Wafer-..:

Nagano, F. ; Iacovo, S. ; Phommahaxay, A....
ECS Journal of Solid State Science and Technology.  11 (2022)  6 - p. 063012 , 2022
Link: https://doi.org/10.1149/..
 
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