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2023 International Electron Devices Meeting (IEDM) ,
4
Backside Power Delivery: Game Changer and Key Enabler of Ad..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
6
Micro-Scale Jet Cooling: A Numerical Study on Improvement O..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
7
Liquid jet impingement cooling of high-performance interpos..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
8
(Why do we need) Wireless Heterogeneous Integration (anyway..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
9
Scaled FinFETs Connected by Using Both Wafer Sides for Rout..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
10
Investigating moisture diffusion in Mold Compounds (MCs) fo..:
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2022 International Electron Devices Meeting (IEDM) ,
11
Insights into Scaled Logic Devices Connected from Both Wafe..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
12
Enabling Active Backside Technology for ESD and LU Reliabil..:
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2022 International Electron Devices Meeting (IEDM) ,
13
Power, Performance, Area and Thermal Analysis of 2D and 3D ..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
14