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Bhogaraju, Sri Krishna
32  Ergebnisse:
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1

Decomposition mechanism and morphological evolution of in s..:

Mohan, Nihesh ; Ahuir-Torres, Juan Ignacio ; Bhogaraju, Sri Krishna...
New Journal of Chemistry.  48 (2024)  15 - p. 6796-6808 , 2024
Link: https://doi.org/10.1039/..
 
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2

Thermomechanical Degradation of Sintered Copper under High-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Paret, Paul ; Bhogaraju, Sri Krishna ; Busse, Dirk... - p. 1219-1224 , 2024
Link: https://doi.org/10.1109/..
 
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3

Correlation between the characteristics of printed sinter p..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
Steinberger, Fabian ; Bhogaraju, Sri Krishna ; Elger, Gordon - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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4

Reliability of Copper Sintered Interconnects Under Extreme ..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Bhogaraju, Sri Krishna ; Ugolini, Francesco ; Belponer, Federico.. - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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5

Rapid Sintering of Inkjet Printed Cu Complex Inks Using Las..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Mohan, Nihesh ; Ahuir-Torres, Juan Ignacio ; Bhogaraju, Sri Krishna.. - p. 1-7 , 2023
Link: https://doi.org/10.23919..
 
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6

Understanding Cu Sintering and Its Role on Corrosion Behavi..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Ahuir-Torres, Juan Ignacio ; Bhogaraju, Sri Krishna ; West, Geoff.. - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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7

Novel Low Temperature and Low Pressure Sintering of ADAS Ra..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Bhogaraju, Sri Krishna ; Mohan, Nihesh ; Steinberger, Fabian... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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8

Low cost copper based sintered interconnect material for op..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Bhogaraju, Sri Krishna ; Schmid, Maximilian ; Liu, E... - p. 1720-1725 , 2022
Link: https://doi.org/10.1109/..
 
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9

Investigation Of Stress Generated By Interconnection Proces..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liu, E ; Bhogaraju, Sri Krishna ; Lux, Kerstin.. - p. 739-745 , 2022
Link: https://doi.org/10.1109/..
 
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10

Effect of binders on the performance of copper sintering pa..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Saccon, Rodolfo ; Benin, Alice ; Bhogaraju, Sri Krishna. - p. 71-72 , 2022
Link: https://doi.org/10.23919..
 
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11

Investigation of stress relaxation in SAC305 with micro-Ram..:

Liu, E ; Bhogaraju, Sri Krishna ; Wunderle, Bernhard.
Microelectronics Reliability.  138 (2022)  - p. 114664 , 2022
Link: https://doi.org/10.1016/..
 
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12

Die-Attach Bonding with Etched Micro Brass Metal Pigment Fl..:

Bhogaraju, Sri Krishna ; R. Kotadia, Hiren ; Conti, Fosca...
ACS Applied Electronic Materials.  3 (2021)  10 - p. 4587-4603 , 2021
Link: https://doi.org/10.1021/..
 
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13

Formic acid and formate salts for chemical vapor deposition..:

Mokhtari, Omid ; Conti, Fosca ; Saccon, Rodolfo..
New Journal of Chemistry.  45 (2021)  43 - p. 20133-20139 , 2021
Link: https://doi.org/10.1039/..
 
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14

Development of an In-Line Capable Transient Thermal Analysi..:

, In: 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Schmid, Maximilian ; Bhogaraju, Sri Krishna ; Riedel, Andreas. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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15

Finite Element simulations and Raman measurements to invest..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Conti, Fosca ; Liu, E ; Bhogaraju, Sri Krishna.. - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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