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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
1
Solutions for Process Challenges on Fan-Out Wafer Level Pac..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
2
Defect Localization in Through-Si-Interposer Based 2.5D ICs:
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2024 IEEE Silicon Photonics Conference (SiPhotonics) ,
6
Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Pho..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
7
A Compact Wafer-Level Heterogeneously Integrated Scalable O..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
8
Characterization of Differential TMV Vertical Interconnects..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
9
Physical Verification for 3D Heterogeneous Integrated Elect..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
10