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2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
1
Efficient Boundary Element Methodology for Analyzing Interc..:
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2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
2
Modeling Finite Dielectric Structures Embedded in Layered M..:
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2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
3