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Birlem, Olav
4  Ergebnisse:
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Cu nanowire fine-pitch joints for next gen heterogeneous ch..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Bickel, Steffen ; Quednau, Sebastian ; Birlem, Olav.. - p. 1376-1381 , 2024
Link: https://doi.org/10.1109/..
 
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Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System ..:

Bickel, Steffen ; Quednau, Sebastian ; Birlem, Olav...
Journal of Electronic Materials.  53 (2024)  8 - p. 4410-4420 , 2024
Link: https://doi.org/10.1007/..
 
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Novel Cu-nanowire-based technology enabling fine pitch inte..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Shehzad, Adil ; Yin, Ran ; Panchenko, Iuliana... - p. 118-123 , 2022
Link: https://doi.org/10.1109/..
 
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4

Room Temperature Interconnection Technology for Bonding Fin..:

Farough Roustaie ; Sebastian Quednau ; Florian Dassinger.
info:eu-repo/grantAgreement/EC/H2020/830061/.  , 2021
Link: https://zenodo.org/recor..
 
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