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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Concepts for realizing High-Voltage Power Modules by Embedd..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Panel Level Packaging – Where are the Technology Limits?:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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