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2022 IEEE International Ultrasonics Symposium (IUS) ,
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Metallurgical AuSn Bonding of Piezoelectric Layers:
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2020 IEEE International Ultrasonics Symposium (IUS) ,
3
Ultrasound Transducers for High Pressure Environments Up to..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
4
Bi Behaviour in Au–(In–Bi) SLID Bonding:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
5
Impact of High Pressures on Au-Sn Solid Liquid Interdiffusi..:
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2019 IEEE International Ultrasonics Symposium (IUS) ,
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