Bolstad, Per Kristian
34  Ergebnisse:
Personensuche X
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2

Metallurgical AuSn Bonding of Piezoelectric Layers:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
 
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3

Ultrasound Transducers for High Pressure Environments Up to..:

, In: 2020 IEEE International Ultrasonics Symposium (IUS),
 
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4

Bi Behaviour in Au–(In–Bi) SLID Bonding:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
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5

Impact of High Pressures on Au-Sn Solid Liquid Interdiffusi..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
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6

Intermetallic Bonding as an Alternative to Polymeric Adhesi..:

, In: 2019 IEEE International Ultrasonics Symposium (IUS),
Bolstad, Per Kristian ; Le-Anh, Duy ; Hoff, Lars. - p. 1765-1768 , 2019
 
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8

Impact of High Pressures on Au-Sn Solid Liquid Interdiffusi..:

Bolstad, Per Kristian ; Kuziora, Stephane ; Nguyen, Hoang-Vu...
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).  , 2020
 
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