Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Borgesen, Peter
60  Ergebnisse:
Personensuche X
?
1

All-electrochemical synthesis of SnBi/SnAgCu structures for..:

Njuki, Michael ; Pasha, Abdullah Faisal ; Das, Ronit..
Journal of Alloys and Compounds.  995 (2024)  - p. 174699 , 2024
Link: https://doi.org/10.1016/..
 
?
2

Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Un..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chakraborty, Souvik ; Chen, Yaxiong ; Sharma, Gaurav... - p. 506-513 , 2024
Link: https://doi.org/10.1109/..
 
?
3

Electrodeposition Complexity and the Root Cause of Interfac..:

Lei, Zhen ; Borgesen, Peter ; Dimitrov, Nikolay
ACS Applied Electronic Materials.  , 2024
Link: https://doi.org/10.1021/..
 
?
4

Electrical Behavior of Thin Die Assembly on Flexible Substr..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lieberman, Sara ; Abbara, El Mehdi ; Gee, Nathaniel... - p. 1670-1676 , 2024
Link: https://doi.org/10.1109/..
 
?
5

Hydrogen evolution and thermal treatments for removal of pl..:

Lei, Zhen ; Borgesen, Peter ; Dimitrov, Nikolay
Colloids and Surfaces A: Physicochemical and Engineering Aspects.  692 (2024)  - p. 133995 , 2024
Link: https://doi.org/10.1016/..
 
?
6

High stability and reliability additively manufactured meta..:

Alshatnawi, Firas ; Enakerakpo, Emuobosan ; Alhendi, Mohammed...
Materials Today Communications.  39 (2024)  - p. 108682 , 2024
Link: https://doi.org/10.1016/..
 
?
7

Novel SiO2 Cables With Edge Launch Connectors for High Temp..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Alshatnawi, Firas ; Umar, Ashraf ; Enakerakpo, Emuobosan... - p. 1981-1985 , 2024
Link: https://doi.org/10.1109/..
 
?
8

Electrical and Mechanical Behavior of Aerosol Jet–Printed G..:

Alshatnawi, Firas ; Alhendi, Mohammed ; Abbara, El Mehdi...
Advanced Engineering Materials.  25 (2023)  20 - p. , 2023
Link: https://doi.org/10.1002/..
 
?
9

Early transient creep of single crystal SnAgCu solder joint:

Das, Ronit ; Thekkut, Sanoop ; Sivasubramony, Rajesh Sharma...
Journal of Materials Science: Materials in Electronics.  33 (2022)  17 - p. 13657-13667 , 2022
Link: https://doi.org/10.1007/..
 
?
10

High Temperature Die Interconnection Approaches:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Alshatnawi, Firas ; Alhendi, Mohammed ; Al-Haidari, Riadh A.... - p. 1539-1545 , 2022
Link: https://doi.org/10.1109/..
 
?
11

Printed electronics for extreme high temperature environmen..:

Alhendi, Mohammed ; Alshatnawi, Firas ; Abbara, El Mehdi...
Additive Manufacturing.  54 (2022)  - p. 102709 , 2022
Link: https://doi.org/10.1016/..
 
?
12

Flexible inkjet-printed Patch antenna array on mesoporous P..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Khinda, Gurvinder Singh ; Umar, Ashraf ; Cadwell, Ryan J.... - p. 1824-1831 , 2020
Link: https://doi.org/10.1109/..
 
?
13

A Comparative Study of Aerosol Jet Printing on Polyimide an..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Alhendi, Mohammed ; Umar, Ashraf ; Abbara, El Mehdi... - p. 1579-1585 , 2020
Link: https://doi.org/10.1109/..
 
?
14

Assessing Current‐Carrying Capacity of Aerosol Jet Printed ..:

Alhendi, Mohammed ; Sivasubramony, Rajesh S. ; Weerawarne, Darshana L....
Advanced Engineering Materials.  22 (2020)  11 - p. , 2020
Link: https://doi.org/10.1002/..
 
?
15

Effect of substrate properties on isothermal fatigue of aer..:

Muralidharan, Roshan ; Raj, Arun ; Sivasubramony, Rajesh Sharma...
Journal of Materials Research.  34 (2019)  16 - p. 2903-2910 , 2019
Link: https://doi.org/10.1557/..
 
1-15