Boulard, F.
249  Ergebnisse:
Personensuche X
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1

Integration of HfO2-based 3D OxRAM with GAA stacked-nanoshe..:

, In: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC),
Dubreuil, T. ; Barraud, S. ; Pedini, J.-M.... - p. 117-120 , 2023
 
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2

3D sequential integration with Si CMOS stacked on 28nm indu..:

, In: 2023 International Electron Devices Meeting (IEDM),
Mota-Frutuoso, T. ; Lapras, V. ; Brunet, L.... - p. 1-4 , 2023
 
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3

Bevel contamination management in 3D integration by localiz..:

Boulard, F. ; Gros, V. ; Porzier, C....
Microelectronic Engineering.  265 (2022)  - p. 111875 , 2022
 
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4

A new FDSOI spin qubit platform with 40nm effective control..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
 
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6

MTF Characterization of Small Pixel Pitch IR Cooled Photodi..:

Yèche, A. ; Gravrand, O. ; Ferron, A....
Journal of Electronic Materials.  49 (2020)  11 - p. 6900-6907 , 2020
 
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7

Development of Electron Beam Induced Current Characterizati..:

Yèche, A. ; Boulard, F. ; Gravrand, O.
Journal of Electronic Materials.  48 (2019)  10 - p. 6045-6052 , 2019
 
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8

Development of Electron Beam Induced Current for diffusion ..:

Yèche, A. ; Boulard, F. ; Cervera, C....
Infrared Physics & Technology.  95 (2018)  - p. 170-176 , 2018
 
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9

Shockley–Read–Hall Lifetime Study and Implication in HgCdTe..:

Gravrand, O. ; Rothman, J. ; Delacourt, B....
Journal of Electronic Materials.  47 (2018)  10 - p. 5680-5690 , 2018
 
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10

Temperature and Injection Dependence of Photoluminescence D..:

Delacourt, B. ; Ballet, P. ; Boulard, F....
Journal of Electronic Materials.  46 (2017)  12 - p. 6817-6828 , 2017
 
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11

Gas mixture influence on the reactive ion etching of InSb i..:

Abautret, J ; Evirgen, A ; Perez, J P...
Semiconductor Science and Technology.  30 (2015)  6 - p. 065014 , 2015
 
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13

A New nBn IR Detection Concept Using HgCdTe Material:

Gravrand, O. ; Boulard, F. ; Ferron, A...
Journal of Electronic Materials.  44 (2015)  9 - p. 3069-3075 , 2015
 
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