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2024 47th International Spring Seminar on Electronics Technology (ISSE) ,
1
Investigation of Sn grain growth in solder joints by numeri..:
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2023 46th International Spring Seminar on Electronics Technology (ISSE) ,
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Numerical modelling approaches to current reflow soldering ..:
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2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) ,
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