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Braun, Tanja
302  Ergebnisse:
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1

How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Adler, Marius... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

In-Package Characterization of Dielectrics Using Ring Reson..:

, In: 2024 15th German Microwave Conference (GeMiC),
Stadler, Pascal ; Braun, Tobias T. ; Geissler, Christian... - p. 272-275 , 2024
Link: https://doi.org/10.23919..
 
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3

3D Freeform Antenna-in-Package Approach for FOWLP:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Thomas, Tina ; Becker, Karl-Friedrich... - p. 247-252 , 2023
Link: https://doi.org/10.1109/..
 
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4

Application of Machine Learning Methods for Process Optimiz..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Niegisch, Corinna ; Haag, Sabine T. ; Braun, Tanja.. - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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5

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Chernobryvko, Mykola ; Kaiser, Michael P. ; Murugesan, Kavin Senthil... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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6

A novel FOWLP method to integrate delicate MEMS components:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Woehrmann, Markus ; Dreissigacker, Marc ; Braun, Tanja.. - p. 1279-1284 , 2023
Link: https://doi.org/10.1109/..
 
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7

A Closer Look to Fan-out Panel Level Packaging:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Braun, Tanja ; Holck, Ole ; Voitel, Marcus... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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8

Panel Level Packaging – Where are the Technology Limits?:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Obst, Mattis... - p. 807-818 , 2022
Link: https://doi.org/10.1109/..
 
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9

Type of vaccine and immunosuppressive therapy but not diagn..:

Frommert, Leonie Maria ; Arumahandi de Silva, Amanthi Nadira ; Zernicke, Jan...
RMD Open.  8 (2022)  2 - p. e002650 , 2022
Link: https://doi.org/10.1136/..
 
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10

The erythropoietin‐derived peptide ARA 284 reduces tissue w..:

Palus, Sandra ; Elkina, Yulia ; Braun, Tanja...
Journal of Cachexia, Sarcopenia and Muscle.  13 (2022)  4 - p. 2202-2210 , 2022
Link: https://doi.org/10.1002/..
 
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11

Potentials of a SiC Fan-out Wafer Level Package for High Po..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Mackowiak, Piotr ; Wittler, Olaf ; Braun, Tanja... - p. 45-48 , 2022
Link: https://doi.org/10.1109/..
 
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12

SiC Fan-out Wafer Level Package for High Power Application:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mackowiak, Piotr ; Wittler, Olaf ; Braun, Tanja... - p. 104-108 , 2022
Link: https://doi.org/10.1109/..
 
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13

Mold based D-band slotted SIW bandpass filter:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Chernobryvko, Mykola ; Kanitkar, Abhijeet ; Muller, Friedrich... - p. 589-592 , 2022
Link: https://doi.org/10.1109/..
 
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14

Design, Fabrication and Measurement of FOWLP-based Series-F..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Le, Thi Huyen ; Schwanitz, Oliver ; Ndip, Ivan... - p. 593-596 , 2022
Link: https://doi.org/10.1109/..
 
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15

High-Resolution Printing of Redistribution Layers for Fan-O..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Roshanghias, Ali ; Dreissigacker, Marc ; Gradzka-Kurzaj, Iwona... - p. 254-258 , 2022
Link: https://doi.org/10.1109/..
 
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