Bresson, N.
340  Ergebnisse:
Personensuche X
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3

Die to Wafer Direct Hybid Bonding Demonstration with High A..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Jouve, A. ; Sanchez, L. ; Castan, C.... - p. 1-7 , 2019
 
?
4

Towards a Complete Direct Hybrid Bonding D2W Integration Fl..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Bourjot, E. ; Stewart, P. ; Dubarry, C.... - p. 1-5 , 2019
 
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?
9

Innovating SOI films: impact of thickness and temperature:

Bresson, N ; Cristoloveanu, S
Microelectronic Engineering.  72 (2004)  1-4 - p. 357-361 , 2004
 
?
10

Characterization of multiple Si∕SiO2 interfaces in silicon-..:

Jun, B. ; White, Y. V. ; Schrimpf, R. D....
Applied Physics Letters.  85 (2004)  15 - p. 3095-3097 , 2004
 
?
11

Contributors:

, In: Natural Resources Conservation and Advances for Sustainability,
Abdelhak, Maghchiche ; Abdullah ; Ahmad, Faheem... - p. xix-xxi , 2022
 
?
12

Five simultaneous artificial intelligence data challenges o..:

Lassau, N. ; Estienne, T. ; de Vomecourt, P....
Diagnostic and Interventional Imaging.  100 (2019)  4 - p. 199-209 , 2019
 
?
13

XRD and ATR/FTIR investigations of various montmorillonite ..:

Ahmed, A. ; Chaker, Y. ; Belarbi, El H....
Journal of Molecular Structure.  1173 (2018)  - p. 653-664 , 2018
 
?
14

Simulation ofW‐band radar reflectivity for model validation..:

Borderies, M. ; Caumont, O. ; Augros, C....
Quarterly Journal of the Royal Meteorological Society.  144 (2018)  711 - p. 391-403 , 2018
 
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