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2022 International Electron Devices Meeting (IEDM) ,
3
Forksheet FETs with Bottom Dielectric Isolation, Self-Align..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
4
Scaled FinFETs Connected by Using Both Wafer Sides for Rout..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
5
Comparison of Electrical Performance of Co-Integrated Forks..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
6
Inspection and metrology challenges for 3 nm node devices a..:
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2020 IEEE Symposium on VLSI Technology ,
7
First Monolithic Integration of 3D Complementary FET (CFET)..:
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2020 IEEE Symposium on VLSI Technology ,
8
Buried Power Rail Integration with Si FinFETs for CMOS Scal..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
9