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Brunion, Moritz
16  Ergebnisse:
Personensuche X
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1

Thermal Analysis of High-Performance Server SoCs from FinFE..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kumar, Nitish ; Sankatali, Venkateswarlu ; Chen, Yukai... - p. 8B.4-1-8B.4-8 , 2024
Link: https://doi.org/10.1109/..
 
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2

Hier-3D: A Methodology for Physical Hierarchy Exploration o..:

Bethur, Nesara Eranna ; Agnesina, Anthony ; Brunion, Moritz...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  7 - p. 1957-1970 , 2024
Link: https://doi.org/10.1109/..
 
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3

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

Huang, Yen-Hsiang ; Pentapati, Sai ; Agnesina, Anthony..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  , 2024
Link: https://doi.org/10.1109/..
 
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4

3D Partitioning with Pipeline Optimization for Low-Latency ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Das, Sudipta ; Riedel, Samuel ; Bertuletti, Marco... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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5

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Pentapati, Sai ; Agnesina, Anthony ; Brunion, Moritz.. - p. 62-70 , 2023
Link: https://dl.acm.org/doi/1..
 
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6

Power, Performance, Area, and Cost Analysis of Face-to-Face..:

Agnesina, Anthony ; Brunion, Moritz ; Kim, Jinwoo...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  3 - p. 300-314 , 2023
Link: https://doi.org/10.1109/..
 
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7

Impact of 3-D Integration on Thermal Performance of RISC-V ..:

Venkateswarlu, Sankatali ; Mishra, Subrat ; Oprins, Herman...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  31 (2023)  12 - p. 1896-1904 , 2023
Link: https://doi.org/10.1109/..
 
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8

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Naeim, Mohamed ; Yang, Hanqi ; Chen, Pinhong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Hier-3D: A Hierarchical Physical Design Methodology for Fac..:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
Agnesina, Anthony ; Brunion, Moritz ; Garcia-Ortiz, Alberto... - p. 1-6 , 2022
Link: https://dl.acm.org/doi/1..
 
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10

Thermal Performance Analysis of Mempool RISC-V Multicore So:

Venkateswarlu, Sankatali ; Mishra, Subrat ; Oprins, Herman...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  30 (2022)  11 - p. 1668-1676 , 2022
Link: https://doi.org/10.1109/..
 
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11

Power, performance, area and cost analysis of memory-on-log..:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
Agnesina, Anthony ; Brunion, Moritz ; Kim, Jinwoo... - p. 1-6 , 2021
Link: https://dl.acm.org/doi/1..
 
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12

MemPool-3D: Boosting Performance and Efficiency of Shared-L..:

Calvacante, Matheus ; Agnesina, Anthony ; Riedel, Samuel...
https://dipot.ulb.ac.be/dspace/bitstream/2013/351862/3/9774726.  , 2022
Link: http://hdl.handle.net/20..
 
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13

Hier-3D: A Hierarchical Physical Design Methodology for Fac..:

Agnesina, Anthony ; Brunion, Moritz ; García-Ortiz, Alberto...
uri/info:doi/10.1145/3531437.3539702.  , 2022
Link: http://hdl.handle.net/20..
 
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14

Hier-3D: A Hierarchical Physical Design Methodology for Fac..:

Agnesina, Anthony ; Brunion, Moritz ; García-Ortiz, Alberto...
info:eu-repo/semantics/altIdentifier/doi/10.1145/3531437.3539702.  , 2022
Link: https://hdl.handle.net/2..
 
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15

Power, Performance, Area and Cost Analysis of Memory-on-Log..:

Agnesina, Anthony ; Brunion, Moritz ; Kim, Jinwoo...
uri/info:doi/10.1109/ISLPED52811.2021.9502475.  , 2021
Link: http://hdl.handle.net/20..
 
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