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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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3D Package CSP Solder Joints Morphological Parameters Sensi..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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Resistive Failure Localization of Electronic Components by ..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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Investigation on failures of plastic package devices with u..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Investigating the Overdischarge Failure on Copper Dendritic..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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Finite-Element Analysis of Strain Distribution in Ceramic M..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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Thermal Fitigure Life Prediction on PBGA Solder Joints of T..:
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2009 International Conference on Information Engineering and Computer Science ,
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GML Database Based on Oracle XML DB:
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2009 Second International Workshop on Knowledge Discovery and Data Mining ,
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Design of Sliding Mode Controller with Low-Pass Filter for ..:
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2009 International Conference on Information Engineering and Computer Science ,
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VTD-XML-Based Design and Implementation of GML Parsing Proj..:
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2008 10th International Conference on Control, Automation, Robotics and Vision ,
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