E-LIB Suche - Ergebnisse für: Cale, Timothy

1

Grain–continuum modelling of material behaviour:

, In: Multiscale Materials Modelling,

Bloomfield, Max ; Cale, Timothy , 2007

Link: https://doi.org/10.1201/..

2

Applications of plasma coatings in artificial joints: an ov..:

Liang, Hong ; Shi, Bing ; Fairchild, Aaron.
Vacuum. 73 (2004) 3-4 - p. 317-326 , 2004

Link: https://doi.org/10.1016/..

3

THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATI..:

Cale, Timothy S. ; Lu, Jian-Qiang ; Gutmann, Ronald J.
Chemical Engineering Communications. 195 (2008) 8 - p. 847-888 , 2008

Link: https://doi.org/10.1080/..

4

Modeling multiscale effects on transients during chemical v..:

Gobbert, Matthias K. ; Cale, Timothy S.
Surface and Coatings Technology. 201 (2007) 22-23 - p. 8830-8837 , 2007

Link: https://doi.org/10.1016/..

5

Stress-Induced Grain Boundary Migration in Polycrystalline ..:

Bloomfield, Max O. ; Bentz, Daniel N. ; Cale, Timothy S.
Journal of Electronic Materials. 37 (2007) 3 - p. 249-263 , 2007

Link: https://doi.org/10.1007/..

6

Two deterministic approaches to topography evolution:

Cale, Timothy S. ; Bloomfield, Max O. ; Gobbert, Matthias K.
Surface and Coatings Technology. 201 (2007) 22-23 - p. 8873-8877 , 2007

Link: https://doi.org/10.1016/..

7

Grain–continuum modelling of material behaviour:

, In: Multiscale Materials Modelling,

Bloomfield, Max O. ; Cale, Timothy S. - p. 148-188 , 2007

Link: https://doi.org/10.1533/..

8

A kinetic transport and reaction model and simulator for ra..:

Gobbert, Matthias K. ; Cale, Timothy S.
Journal of Computational Physics. 213 (2006) 2 - p. 591-612 , 2006

Link: https://doi.org/10.1016/..

9

A Galerkin Method for the Simulation of the Transient 2-D/2..:

Gobbert, Matthias K. ; Webster, Samuel G. ; Cale, Timothy S.
Journal of Scientific Computing. 30 (2006) 2 - p. 237-273 , 2006

Link: https://doi.org/10.1007/..

10

Thermal stresses in 3D IC inter-wafer interconnects:

Zhang, Jing ; Bloomfield, Max O. ; Lu, Jian-Qiang..
Microelectronic Engineering. 82 (2005) 3-4 - p. 534-547 , 2005

Link: https://doi.org/10.1016/..

11

Nanoplate elasticity under surface reconstruction:

Shim, Hyun Woo ; Zhou, L. G. ; Huang, Hanchen.
Applied Physics Letters. 86 (2005) 15 - p. , 2005

Link: https://doi.org/10.1063/..

12

Material removal model for chemical–mechanical polishing co..:

Seok, Jongwon ; Sukam, Cyriaque P. ; Kim, Andrew T...
Wear. 257 (2004) 5-6 - p. 496-508 , 2004

Link: https://doi.org/10.1016/..

13

Formation and evolution of grain structures in thin films:

Bloomfield, Max O. ; Cale, Timothy S.
Microelectronic Engineering. 76 (2004) 1-4 - p. 195-204 , 2004

Link: https://doi.org/10.1016/..

14

A computational framework for modelling grain-structure evo..:

Bloomfield, Max O. ; Richards, David F. ; Cale†, Timothy S.
Philosophical Magazine. 83 (2003) 31-34 - p. 3549-3568 , 2003

Link: https://doi.org/10.1080/..

15

Model relating process variables to film electrical propert..:

Jain, Pushkar ; Bhagwat, Vinay ; Rymaszewski, Eugene J....
Journal of Applied Physics. 93 (2003) 6 - p. 3596-3604 , 2003

Link: https://doi.org/10.1063/..