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X
Canaperi, Donald F.
17  Ergebnisse:
Personensuche X
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1

Molecular Interactions in Copper Chemical Mechanical Planar..:

Krishnan, Mahadevaiyer ; Canaperi, Donald F. ; Rangarajan, Sarukkai K.
ECS Journal of Solid State Science and Technology.  13 (2024)  7 - p. 074005 , 2024
Link: https://doi.org/10.1149/..
 
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2

Wet Chemical Processes for BEOL Technology:

, In: Springer Handbook of Semiconductor Devices; Springer Handbooks,
Peethala, Cornelius Brown ; Kelly, James J. ; Canaperi, Donald F... - p. 219-257 , 2022
Link: https://doi.org/10.1007/..
 
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3

Low Hydrogen Silicon Carbon Nitride Cap for High Performanc..:

Nguyen, Son van ; Shobha, Hosadurga k ; Haigh, Thomas J...
ECS Transactions.  77 (2017)  5 - p. 111-120 , 2017
Link: https://doi.org/10.1149/..
 
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4

CMP Challenges for Advanced Technology Nodes:

Zhang, John H. ; Huang, Haigou ; Greene, Andrew M....
MRS Advances.  2 (2017)  44 - p. 2361-2372 , 2017
Link: https://doi.org/10.1557/..
 
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5

CMP Challenges for Advanced Technology Nodes beyond Si:

Zhang, John H ; Tsai, Stan ; Surisetty, Charan...
MRS Advances.  2 (2017)  51 - p. 2891-2902 , 2017
Link: https://doi.org/10.1557/..
 
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6

BEOL Dielectric Processing for Cu-Low k Nano Interconnect- ..:

Nguyen, Son van ; Shobha, Hosadurga k ; Haigh, Thomas J..
ECS Transactions.  75 (2017)  33 - p. 5-13 , 2017
Link: https://doi.org/10.1149/..
 
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7

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-..:

Nguyen, Son van ; Priyadarshini, Deepika ; Shobha, Hosadurga k...
ECS Transactions.  61 (2014)  3 - p. 17-28 , 2014
Link: https://doi.org/10.1149/..
 
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8

CMP Defect Reduction and Mitigation: Practices and Future T..:

, In: 2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Tseng, Wei-Tsu ; Boye, Carol ; Silvestre, Claire... - p. 1-6 , 2021
Link: https://doi.org/10.1109/..
 
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9

Method for improving stability of plasma ignition in a mult..:

, In: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Gruss-Gifford, Jessica ; Mehta, Virat ; Straten, Oscar van der... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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10

Comparing PVD Titanium Nitride Film Properties and their Ef..:

, In: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
DeVries, Scott ; De Silva, Ekmini Anuja ; Canaperi, Donald... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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11

CMP Development for Ru Liner Structures beyond 14nm:

Patlolla, Raghuveer R. ; Motoyama, Koichi ; Peethala, Brown...
ECS Journal of Solid State Science and Technology.  7 (2018)  8 - p. P397-P401 , 2018
Link: https://doi.org/10.1149/..
 
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12

BEOL Cu CMP Process Evaluation for Advanced Technology Node:

Tanwar, Kunaljeet ; Canaperi, Donald ; Lofaro, Michael...
Journal of The Electrochemical Society.  160 (2013)  12 - p. D3247-D3254 , 2013
Link: https://doi.org/10.1149/..
 
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13

The Effect of Material and Process Interactions on BEOL Int..:

Spooner, Terry A. ; Arnold, John C. ; Canaperi, Donald...
ECS Transactions.  25 (2009)  7 - p. 279-289 , 2009
Link: https://doi.org/10.1149/..
 
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14

Impact of surface preparation for n-type Si:P and p-type Si..:

Carr, A. ; Peethala, B. ; Raymond, M....
Microelectronic Engineering.  173 (2017)  - p. 22-26 , 2017
Link: https://doi.org/10.1016/..
 
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15

SiGe-on-insulator prepared by wafer bonding and layer trans..:

Huang, L. J. ; Chu, J. O. ; Canaperi, D. F....
Applied Physics Letters.  78 (2001)  9 - p. 1267-1269 , 2001
Link: https://doi.org/10.1063/..
 
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