Carl Wassgren
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Impact of Squeezing on the Microstructure of Thermal Interf..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Kantharaj, Rajath ; Wassgren, Carl ; Morris, Aaron. - p. 1241-1249 , 2021
 
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