Celano, U.
50  Ergebnisse:
Personensuche X
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1

Variability in Planar FeFETs—Channel Percolation Impact:

Kaczmarek, K. ; Bardon, M. Garcia ; Xiang, Y....
IEEE Transactions on Electron Devices.  70 (2023)  7 - p. 3928-3934 , 2023
 
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2

High performance La-doped HZO based ferroelectric capacitor..:

, In: 2022 International Electron Devices Meeting (IEDM),
Popovici, M.I. ; Bizindavyi, J. ; Favia, P.... - p. 6.4.1-6.4.4 , 2022
 
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3

A Correlative Analysis Flow for Electrical and Structural C..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Magnarin, L. ; Agati, M. ; Belmonte, A.... - p. 1-4 , 2022
 
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4

Ultra-low Leakage IGZO-TFTs with Raised Source/Drain for Vt..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Subhechha, S. ; Rassoul, N. ; Belmonte, A.... - p. 292-293 , 2022
 
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5

Harnessing charge injection in Kelvin probe force microscop..:

Celano, U. ; Lee, Y. ; Serron, J....
Solid-State Electronics.  185 (2021)  - p. 108136 , 2021
 
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6

Probing the evolution of electrically active defects in dop..:

, In: 2020 IEEE Symposium on VLSI Technology,
Celano, U. ; Chen, Y.-H. ; Minj, A.... - p. 1-2 , 2020
 
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7

Impact of Charge trapping on Imprint and its Recovery in Hf..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Higashi, Y. ; Di Piazza, L. ; Suzuki, M.... - p. 15.6.1-15.6.4 , 2019
 
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8

Chasing Plasmons in Flatland:

Celano, U. ; Maccaferri, N.
Nano Letters.  19 (2019)  11 - p. 7549-7552 , 2019
 
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9

3D-carrier Profiling and Parasitic Resistance Analysis in V..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Eyben, P. ; Machillot, J. ; Kim, M.... - p. 11.3.1-11.3.4 , 2019
 
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10

Reverse tip sample scanning for precise and high-throughput..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Celano, U. ; Hantschel, T. ; Boehme, T.... - p. 5.1.1-5.1.4 , 2019
 
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12

Quantitative retention model for filamentary oxide-based re..:

Degraeve, R. ; Chen, C.Y. ; Celano, U....
Microelectronic Engineering.  178 (2017)  - p. 38-41 , 2017
 
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14

Dopant, composition and carrier profiling for 3D structures:

Vandervorst, W. ; Fleischmann, C. ; Bogdanowicz, J....
Materials Science in Semiconductor Processing.  62 (2017)  - p. 31-48 , 2017
 
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