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Chai, Tai Chong
874  Ergebnisse:
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1

77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar Wit..:

Sun, Mei ; Guan Lim, Teck ; Soon Wee Ho, David...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 537-546 , 2024
Link: https://doi.org/10.1109/..
 
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2

Assembly process characterization of 3D Stacking of Heterog..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Siang Lim, Sharon Pei ; Long Lau, Boon ; Chai, Tai Chong. - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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3

Assembly challenges and demonstrations of ultra-large Anten..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Wee, David Ho Soon. - p. 635-642 , 2022
Link: https://doi.org/10.1109/..
 
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4

Wafer Warpage Optimization Via Finite Element Analysis for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ji, Lin ; Chai, Tai Chong ; Siang Lim, Sharon Pei - p. 707-711 , 2022
Link: https://doi.org/10.1109/..
 
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5

Development of wafer level solderball placement process for..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Jaafar, Norhanani ; Chong, Ser Choong.. - p. 435-439 , 2020
Link: https://doi.org/10.1109/..
 
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6

Demonstration of Vertically Integrated POP using FOWLP Appr..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Ser Choong ; Wai Leong Ching, Eva ; Pei Siang, Sharon Lim.. - p. 873-878 , 2020
Link: https://doi.org/10.1109/..
 
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7

Laser drilling and Plasma Cleaning Process for Blind Via Th..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Hsiao, Hsiang-Yao ; Wee Ho, David Soon ; Sing Lim, Keith Cheng... - p. 14-18 , 2020
Link: https://doi.org/10.1109/..
 
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8

Investigation of Thermal Performance of Antenna in Package ..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Han, Yong ; Chai, Tai Chong ; Lim, Teck Guan - p. 246-250 , 2020
Link: https://doi.org/10.1109/..
 
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9

Modular sensor chip design for package stress evaluation an..:

Trigg, A.D. ; Chai, Tai Chong ; Zhang, Xiaowu..
Microelectronics Reliability.  52 (2012)  8 - p. 1581-1585 , 2012
Link: https://doi.org/10.1016/..
 
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10

Assembly and reliability of micro-bumped chips with Through..:

, In: 2009 11th Electronics Packaging Technology Conference,
Ong, Yue Ying ; Chai, Tai Chong ; Yu, Daquan... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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11

Electrochemical migration study of fine pitch lead free mic..:

, In: 2009 11th Electronics Packaging Technology Conference,
Yu, Da-Quan ; Chai, Tai Chong ; Thew, Meei Ling. - p. None , 2009
Link: https://doi.org/10.1109/..
 
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12

Finite element modeling of capacitive coupling voltage cont..:

Tan, Cher Ming ; Yanuar, Stanny ; Chai, Tai Chong
Microelectronics Reliability.  47 (2007)  9-11 - p. 1555-1560 , 2007
Link: https://doi.org/10.1016/..
 
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13

The mechanics of the solder ball shear test and the effect ..:

Chia, Julian Yan Hon ; Cotterell, Brian ; Chai, Tai Chong
Materials Science and Engineering: A.  417 (2006)  1-2 - p. 259-274 , 2006
Link: https://doi.org/10.1016/..
 
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14

Feasibility study of the application of voltage contrast to..:

Tan, Cher Ming ; Gan, Zhenghao ; Chai, Tai Chong
Microelectronics Reliability.  46 (2006)  5-6 - p. 939-948 , 2006
Link: https://doi.org/10.1016/..
 
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15

Non-destructive identification of open circuit in wiring on..:

Tan, Cher Ming ; Lim, Kim Peng ; Chai, Tai Chong.
Microelectronics Reliability.  45 (2005)  9-11 - p. 1572-1575 , 2005
Link: https://doi.org/10.1016/..
 
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