E-LIB Suche - Ergebnisse für: Chang-Bo, Ke

1

Optimal Key-Tree for RFID Authentication Protocols with Sto..:

, In: Science of Cyber Security; Lecture Notes in Computer Science,

Shao-Hui, Wang ; Yan-Xuan, Zhang ; Chang-Bo, Ke.. - p. 278-292 , 2019

Link: https://doi.org/10.1007/..

2

The Twinning Modes of B2-B19′ Martensitic Transformation in..:

Ke, Chang Bo ; Cao, Shan Shan ; Ma, Xiao.
Advanced Materials Research. 399-401 (2011) - p. 1768-1772 , 2011

Link: https://doi.org/10.4028/..

3

Phase Field Simulation of Ni4Ti3 Precipitation in Porous Ni..:

Ke, Chang Bo ; Ma, Xiao ; Zhang, Xin Ping
Materials Science Forum. 654-656 (2010) - p. 1504-1507 , 2010

Link: https://doi.org/10.4028/..

4

An Intensive Study of Effects of Orientations of Cu Bumps o..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Zheng, Deng-Wu ; Zhou, Min-Bo ; Liu, Shuai.. - p. 1760-1766 , 2023

Link: https://doi.org/10.1109/..

5

An Extensive Study of the Effects of Packaging Structure an..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Lyu, Guang-Chao ; Chen, Bin ; Zhang, Xin-Ping... - p. 647-654 , 2023

Link: https://doi.org/10.1109/..

6

Atomic-scale study of Cu–Cu direct bonding with assistance ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),

Zheng, Deng-Wu ; Zhou, Min-Bo ; Liu, Shuai.. - p. 1-5 , 2022

Link: https://doi.org/10.1109/..

7

Interfacial Crack Initiation and Delamination Propagation i..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Fei, Jiu-Bin ; Xu, Tao ; Zhou, Jie-Ying.. - p. 1186-1191 , 2020

Link: https://doi.org/10.1109/..

8

Three-dimensional Simulation of Effects of Electro-Thermo-M..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Zhou, Jie-Ying ; Wang, Zheng ; Wei, Cheng... - p. 1659-1664 , 2020

Link: https://doi.org/10.1109/..

9

Effects of size distributions of copper nanoparticles on th..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),

Wu, Xue ; Huang, Hai-Jun ; Zhang, Ze-Jun... - p. 1-4 , 2019

Link: https://doi.org/10.1109/..

10

Microstructural evolution and change in macroscopic physica..:

Liang, Shui-Bao ; Ke, Chang-Bo ; Wei, Cheng...
Journal of Materials Research. 34 (2019) 16 - p. 2775-2788 , 2019

Link: https://doi.org/10.1557/..

11

Anisotropic Negative Thermal Expansion Behavior of the As-F..:

Zhao, Zhong-Xun ; Ma, Xiao ; Cao, Shan-Shan..
Shape Memory and Superelasticity. 4 (2017) 1 - p. 218-223 , 2017

Link: https://doi.org/10.1007/..

12

Morphological evolution and growth kinetics of Kirkendall v..:

MA, Wen-jing ; KE, Chang-bo ; LIANG, Shui-bao..
Transactions of Nonferrous Metals Society of China. 27 (2017) 3 - p. 599-607 , 2017

Link: https://doi.org/10.1016/..

13

Microstructure Simulation and Thermo-Mechanical Behavior An..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),

Liang, Shui-Bao ; Ke, Chang-Bo ; Li, Bin... - p. 1668-1674 , 2017

Link: https://doi.org/10.1109/..

14

Phase transformation and damping behavior of lightweight po..:

JIANG, Hong-jie ; KE, Chang-bo ; CAO, Shan-shan..
Transactions of Nonferrous Metals Society of China. 23 (2013) 7 - p. 2029-2036 , 2013

Link: https://doi.org/10.1016/..

15

Modeling of Ni4Ti3 precipitation during stress-free and str..:

KE, Chang-bo ; CAO, Shan-shan ; MA, Xiao.
Transactions of Nonferrous Metals Society of China. 22 (2012) 10 - p. 2578-2585 , 2012

Link: https://doi.org/10.1016/..