Chao, Jui-Lin
5182  Ergebnisse:
Personensuche X
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1

Cu Nanoparticle Sintering by Electrical Current:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wu, Albert T. ; Sheng, Tzu-Hao ; Chao, Jui-Lin.. - p. 107-108 , 2024
 
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2

The effect of microstructure for Ni-based surface finishing..:

Chao, Jui-Lin ; Lin, Si-Wei ; Lin, Jing-Chie...
Surface and Coatings Technology.  456 (2023)  - p. 129252 , 2023
 
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3

Hybrid SnBi/SAC Low-Temperature Solder Bump:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Wu, Albert T. ; Chao, Jui-Lin ; Lai, Yu-Yuan. - p. 213-214 , 2023
 
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5

Corrosion behaviors of Co, Co/Pd, and Co/Pd/Au surface fini..:

Lin, Si-Wei ; Chao, Jui-Lin ; Ku, Shu-Chi..
Journal of the Taiwan Institute of Chemical Engineers.  138 (2022)  - p. 104480 , 2022
 
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6

Hybrid Solder Joint for Low-Temperature Bonding Application:

Lai, Yu-Yuan ; Chao, Jui-Lin ; Hsu, Chia-Jung..
Journal of Electronic Materials.  52 (2022)  2 - p. 782-791 , 2022
 
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7

Novel solid-state pressureless approach for Cu-embedded int..:

Huang, Kuo-Shuo ; Shen, Tzu-Hao ; Liu, Wei..
Materials Chemistry and Physics.  272 (2021)  - p. 124966 , 2021
 
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14

Communicating the corporate social responsibility (CSR) of ..:

Liao, Pin-Chao ; Xia, Ni-Ni ; Wu, Chun-Lin..
Journal of Cleaner Production.  156 (2017)  - p. 327-336 , 2017
 
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