Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Chapelon, D.
2243  Ergebnisse:
Personensuche X
?
1

Elastic and thermo-elastic characterizations of thin resin ..:

Devos, A. ; Chevreux, F. ; Licitra, C...
Photoacoustics.  31 (2023)  - p. 100498 , 2023
Link: https://doi.org/10.1016/..
 
?
2

$1.62\mu \mathrm{m}$ Global Shutter Quantum Dot Image Senso..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Steckel, J. S. ; Josse, E. ; Pattantyus-Abraham, A. G.... - p. 23.4.1-23.4.4 , 2021
Link: https://doi.org/10.1109/..
 
?
3

P05.05 Safety and feasibility of temporary blood-brain barr..:

Idbaih, A ; Canney, M ; Bouchoux, G...
Neuro-Oncology.  21 (2019)  Supplement_3 - p. iii34-iii35 , 2019
Link: https://doi.org/10.1093/..
 
?
4

Salvage external beam radiation therapy (EBRT) for local re..:

Lee, J.-W. ; Crouzet, S. ; Soria, J....
European Urology Supplements.  16 (2017)  3 - p. e1665-e1666 , 2017
Link: https://doi.org/10.1016/..
 
?
5

Ouverture de la barrière hémato-encéphalique par un disposi..:

Carpentier, A. ; Canney, M. ; Horodyckid, C....
Neurochirurgie.  60 (2014)  6 - p. 329 , 2014
Link: https://doi.org/10.1016/..
 
?
6

An Overview of Patterned Metal/Dielectric Surface Bonding: ..:

Di Cioccio, L. ; Gueguen, P. ; Taibi, R....
Journal of The Electrochemical Society.  158 (2011)  6 - p. P81-P86 , 2011
Link: https://doi.org/10.1149/..
 
?
7

RF characterization and modelling of high density Through S..:

Cadix, L. ; Bermond, C. ; Fuchs, C....
Microelectronic Engineering.  87 (2010)  3 - p. 491-495 , 2010
Link: https://doi.org/10.1016/..
 
?
8

(Invited) An Overview of Patterned Metal/Dielectric Surface..:

Di Cioccio, Lea ; Gueguen, P. ; Taibi, R....
ECS Transactions.  33 (2010)  4 - p. 3-16 , 2010
Link: https://doi.org/10.1149/..
 
?
9

Dense SiOC cap for damage-less ultra low k integration with..:

Chapelon, L.L. ; Chaabouni, H. ; Imbert, G....
Microelectronic Engineering.  85 (2008)  10 - p. 2098-2101 , 2008
Link: https://doi.org/10.1016/..
 
?
10

Evaluation of a PECVD advanced barrier (k=3.7) for 32nm CMO..:

Chapelon, L.L. ; Petitprez, E. ; Brun, P...
Microelectronic Engineering.  84 (2007)  11 - p. 2624-2628 , 2007
Link: https://doi.org/10.1016/..
 
?
11

Robust integration of an ULK SiOCH dielectric (k=2.3) for h..:

, In: 2007 IEEE International Interconnect Technology Conferencee,
Aimadeddine, M. ; Maury, P. ; Delaye, V.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
?
12

Integrated monitoring of ULK dielectrics out-gassing and me..:

Delsol, R. ; Chapelon, L. ; Chaabouni, H....
Microelectronic Engineering.  84 (2007)  11 - p. 2719-2722 , 2007
Link: https://doi.org/10.1016/..
 
?
13

Sidewall restoration of porous ultra low-k dielectrics for ..:

Chaabouni, H. ; Chapelon, L.L. ; Aimadeddine, M....
Microelectronic Engineering.  84 (2007)  11 - p. 2595-2599 , 2007
Link: https://doi.org/10.1016/..
 
?
14

Measuring the Young's modulus of ultralow-k materials with ..:

Chapelon, L.L. ; Vitiello, J. ; Neira, D....
Microelectronic Engineering.  83 (2006)  11-12 - p. 2346-2350 , 2006
Link: https://doi.org/10.1016/..
 
?
15

New techniques to characterize properties of advanced diele..:

Vitiello, J. ; Ducote, V. ; Farcy, A....
Microelectronic Engineering.  83 (2006)  11-12 - p. 2130-2135 , 2006
Link: https://doi.org/10.1016/..
 
1-15