E-LIB Suche - Ergebnisse für: Che Ani, Fakhrozi

1

Undissolved gold in fine-pitch BGA solder joint under therm..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
Journal of Materials Science: Materials in Electronics. 35 (2024) 12 - p. , 2024

Link: https://doi.org/10.1007/..

2

Characterization of SAC – x NiO nano-reinforced lead-free s..:

Che Ani, Fakhrozi ; Jalar, Azman ; Saad, Abdullah Aziz...
Soldering & Surface Mount Technology. 31 (2019) 2 - p. 109-124 , 2019

Link: https://doi.org/10.1108/..

3

SAC–xTiO2 nano-reinforced lead-free solder joint characteri..:

Che Ani, Fakhrozi ; Jalar, Azman ; Saad, Abdullah Aziz...
Soldering & Surface Mount Technology. 30 (2018) 1 - p. 1-13 , 2018

Link: https://doi.org/10.1108/..

4

Keynote speech — 4: Trend on development flexible and stret..:

, In: 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM),

Che Ani, Fakhrozi - p. 1-1 , 2017

Link: https://doi.org/10.1109/..

5

Effect of Die Deflection during Au Wire Bonding Process on ..:

Azahar, Ahmad Zarif ; Bakar, Maria Abu ; Jalar, Azman.
Journal of Materials Engineering and Performance. , 2023

Link: https://doi.org/10.1007/..

6

Investigation of hygrothermally induced failures in multila..:

Apalowo, Rilwan Kayode ; Abas, Aizat ; Bachok, Zuraihana...
Microelectronics Reliability. 146 (2023) - p. 115028 , 2023

Link: https://doi.org/10.1016/..

7

Cardinal and Ordinal Directions Approach in Investigating A..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Ehsan, Abang Annuar...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 9 - p. 1492-1501 , 2022

Link: https://doi.org/10.1109/..

8

Intermetallic Compound Thickness of Ball Grid Array Solder ..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),

Ismail, Adlil Aizat ; Bakar, Maria Abu ; Ehsan, Abang Annuar... - p. 1-4 , 2022

Link: https://doi.org/10.1109/..

9

Effects of Underfill Materials on Behavior of Intermetallic..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),

Ismail, Adlil Aizat ; Bakar, Maria Abu ; Ehsan, Abang Annuar... - p. 1-5 , 2022

Link: https://doi.org/10.1109/..

10

Effect of Potting Encapsulation on Crack Formation and Prop..:

, In: Advances in Robotics, Automation and Data Analytics; Advances in Intelligent Systems and Computing,

Jalar, Azman ; Zain, Syed Mohamad Mardzukey Syed Mohamed ; Ani, Fakhrozi Che.. - p. 351-357 , 2021

Link: https://doi.org/10.1007/..

11

Effect of Moisture Content on Crack Formation During Reflow..:

, In: Advances in Robotics, Automation and Data Analytics; Advances in Intelligent Systems and Computing,

Zain, Syed Mohamad Mardzukey Syed Mohamed ; Ani, Fakhrozi Che ; Ramli, Mohamad Riduwan.. - p. 309-314 , 2021

Link: https://doi.org/10.1007/..

12

Electrochemical migration and corrosion behaviours of SAC30..:

Othman, Norinsan Kamil ; Omar, Fakhrul Rifdi ; Ani, Fakhrozi Che
IOP Conference Series: Materials Science and Engineering. 701 (2019) 1 - p. 012044 , 2019

Link: https://doi.org/10.1088/..

13

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder b..:

Yahaya, Muhamad Zamri ; Ani, Fakhrozi Che ; Samsudin, Zambri...
Materials Science and Engineering: A. 669 (2016) - p. 178-186 , 2016

Link: https://doi.org/10.1016/..

14

Corrosion measurement on shear strength of Cu/Sn–9Zn/Cu lap..:

Affendy, Muhammad Ghaddafy ; Yahaya, Muhamad Zamri ; Ani, Fakhrozi Che.
Measurement. 66 (2015) - p. 195-203 , 2015

Link: https://doi.org/10.1016/..

15

Structural Assessment of Lead Free Solder Joint of Miniatur..:

Saad, Abdullah Aziz ; Bachok, Zuraihana ; Che Ani, Fakhrozi..
http://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/2548/1691. , 2018

Link: http://penerbit.uthm.edu..