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Chen, Gim
106  Ergebnisse:
Personensuche X
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1

Effect of Dissolved Ozone and In-Situ Wafer Cleaning on Pre..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Kashkoush, Ismail ; Waugh, Darian ; Chen, Gim - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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2

Application of In-situ Pre-epi Clean Process for Next Gener..:

, In: 2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS),
Waugh, Darian ; Chen, Gim ; Boecker, Jennifer. - p. 14-17 , 2019
Link: https://doi.org/10.1109/..
 
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3

A New Approach to Tackle Wafer Contact Mark Contamination I..:

Chen, Gim ; Nemeth, Dennis ; Kashkoush, Ismail
ECS Transactions.  92 (2019)  2 - p. 117-123 , 2019
Link: https://doi.org/10.1149/..
 
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4

Effect of Pre-Cleaning on Texturization of c-Si Wafers in a..:

Chen, Gim ; Kashkoush, Ismail
ECS Transactions.  25 (2010)  15 - p. 3-10 , 2010
Link: https://doi.org/10.1149/..
 
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5

Maintaining a Stable Etch Selectivity between Silicon Nitri..:

Liu, Lewis ; Kashkoush, Ismail ; Chen, Gim.
ECS Transactions.  11 (2007)  2 - p. 63-70 , 2007
Link: https://doi.org/10.1149/..
 
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6

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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7

Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ji, Hong Miao ; Chen, Gim Guan ; Chui, K.-J. - p. 951-954 , 2022
Link: https://doi.org/10.1109/..
 
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8

Process Development and Integration for Wafer-to-Wafer Hybr..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Li, Hongyu ; Ji, Hong Miao ; Chen, Gim Guan... - p. 01-04 , 2022
Link: https://doi.org/10.1109/..
 
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9

Growth of nickel-base superalloy bicrystals by the seeding ..:

Chen, Gim S. ; Aimone, Paul R. ; Gao, Ming..
Journal of Crystal Growth.  179 (1997)  3-4 - p. 635-646 , 1997
Link: https://doi.org/10.1016/..
 
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10

A technique for studying the 3-dimensional shape of corrosi..:

Liao, Chi-Min ; Chen, Gim S. ; Wei, Robert P.
Scripta Materialia.  35 (1996)  11 - p. 1341-1346 , 1996
Link: https://doi.org/10.1016/..
 
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11

Percutaneous transhepatic cholecystic ultrasonic lithotrips:

Hwang, Min-Huo ; Mo, Lein-Ray ; Chen, Gim-Der...
Gastrointestinal Endoscopy.  33 (1987)  4 - p. 301-303 , 1987
Link: https://doi.org/10.1016/..
 
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12

Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Van Nhat Anh, Tran ; Guan, Chen Gim... - p. 1880-1884 , 2024
Link: https://doi.org/10.1109/..
 
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13

Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Sundaram, Arvind ; Sandra, San... - p. 803-808 , 2024
Link: https://doi.org/10.1109/..
 
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14

Cu and barrier CMP process development with fine 1μm Cu bon..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Roy, Sangita Chaki ; Guan, Chen Gim ; Venkataraman, Nandini.. - p. 135-138 , 2023
Link: https://doi.org/10.1109/..
 
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15

Optimization of the CMP process for direct wafer-to-wafer o..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ji, Hong-Miao ; Cheemalamarri, Hemanth Kumar ; Chi, Ting-Ta... - p. 421-424 , 2023
Link: https://doi.org/10.1109/..
 
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