Personensuche
X
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
1
Thermal Design of Direct Cooling Power Module for EV Applic..:
, In:
?
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Thermal Design of SiC Power Module for EV/HEV Applications:
, In:
?
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
3