Cheng, Hsi-Kuei
1547  Ergebnisse:
Personensuche X
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1

Impurity Incorporation in the Cu Electrodeposit and Its Eff..:

Lee, Hsuan ; Yu, Tai-Yi ; Cheng, Hsi-Kuei...
Journal of The Electrochemical Society.  164 (2017)  7 - p. D457-D462 , 2017
 
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2

Effects of Cu Electroplating Formulas on the Interfacial Mi..:

Yu, Tai-Yi ; Lee, Hsuan ; Hsu, Hsuan-Ling...
Journal of The Electrochemical Society.  163 (2016)  13 - p. D734-D741 , 2016
 
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3

Microstructural Evolution of Cu/Solder/Cu Pillar-Type Struc..:

Cheng, Hsi-Kuei ; Lin, Yu-Jie ; Chen, Chih-Ming...
Metallurgical and Materials Transactions A.  47 (2016)  8 - p. 3971-3980 , 2016
 
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4

Unusual Morphological Evolution of the Cu Pillar/Solder Mic..:

Cheng, Hsi-Kuei ; Lin, Yu-Jie ; Chang, Hou-Chien...
Metallurgical and Materials Transactions A.  46 (2015)  5 - p. 1834-1837 , 2015
 
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5

Interfacial reactions between Cu and SnAgCu solder doped wi..:

Cheng, Hsi-Kuei ; Huang, Chin-Wen ; Lee, Hsuan...
Journal of Alloys and Compounds.  622 (2015)  - p. 529-534 , 2015
 
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9

Doping ZnO Electron Transport Layers with MoS2 Nanosheets E..:

Huang, Yi-Jiun ; Chen, Hsiu-Cheng ; Lin, Hsi-Kuei.
ACS Applied Materials & Interfaces.  10 (2018)  23 - p. 20196-20204 , 2018
 
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12

Block Copolymer-Tuned Fullerene Electron Transport Layer En..:

Lin, Hsi-Kuei ; Su, Yu-Wei ; Chen, Hsiu-Cheng..
ACS Applied Materials & Interfaces.  8 (2016)  37 - p. 24603-24611 , 2016
 
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