E-LIB Suche - Ergebnisse für: Cherman, V.

1

Modeling-Based Improvement of Micro-Scale Liquid Jet Imping..:

Elsinger, G. ; Oprins, H. ; Cherman, V....
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024

Link: https://doi.org/10.1109/..

2

Micro-Scale Jet Cooling: A Numerical Study on Improvement O..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),

Elsinger, G. ; Oprins, H. ; Cherman, V.... - p. 1-10 , 2023

Link: https://doi.org/10.1109/..

3

Nozzle scaling effects for the thermohydraulic performance ..:

Wei, T.-W. ; Oprins, H. ; Fang, Liang...
Applied Thermal Engineering. 180 (2020) - p. 115767 , 2020

Link: https://doi.org/10.1016/..

4

Demonstration of Package Level 3D-printed Direct Jet Imping..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Wei, T.-W. ; Oprins, H. ; Cherman, V.... - p. 1422-1429 , 2020

Link: https://doi.org/10.1109/..

5

Thermal, Mechanical and Reliability assessment of Hybrid bo..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Cherman, V. ; Van Huylenbroeck, S. ; Lofrano, M.... - p. 548-553 , 2020

Link: https://doi.org/10.1109/..

6

Experimental and numerical investigation of direct liquid j..:

Wei, T.W. ; Oprins, H. ; Cherman, V...
Applied Thermal Engineering. 164 (2020) - p. 114535 , 2020

Link: https://doi.org/10.1016/..

7

Experimental characterization and model validation of liqui..:

Wei, T.-W. ; Oprins, H. ; Cherman, V....
Applied Thermal Engineering. 152 (2019) - p. 308-318 , 2019

Link: https://doi.org/10.1016/..

8

Novell embedded microbump approach for die-to-die and wafer..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Derakhshandeh, J. ; Beyne, E. ; Capuz, G.... - p. 1-6 , 2019

Link: https://doi.org/10.23919..

9

High spatial resolution measurements of thermo-mechanical s..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Cherman, V. ; Lofrano, M. ; Gonzalez, M.... - p. 1-6 , 2019

Link: https://doi.org/10.23919..

10

Thermal Analysis of Polymer 3D Printed Jet Impingement Cool..:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),

Wei, T.-W. ; Oprins, H. ; Cherman, V.... - p. 1243-1252 , 2019

Link: https://doi.org/10.1109/..

11

3D Printed Liquid Jet Impingement Cooler: Demonstration, Op..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),

Wei, T.-W. ; Oprins, H. ; Cherman, V.... - p. 2389-2396 , 2018

Link: https://doi.org/10.1109/..

12

B-Spline X-Ray Diffraction Imaging — Rapid non-destructive ..:

Cowley, A. ; Ivankovic, A. ; Wong, C.S....
Microelectronics Reliability. 59 (2016) - p. 108-116 , 2016

Link: https://doi.org/10.1016/..

13

Chip-Package Interaction in 3D stacked IC packages using Fi..:

Vandevelde, Bart ; Ivankovic, A. ; Debecker, B....
Microelectronics Reliability. 54 (2014) 6-7 - p. 1200-1205 , 2014

Link: https://doi.org/10.1016/..

14

Towards CMOS-compatible single-walled carbon nanotube reson..:

Pathangi, H. ; Cherman, V. ; Khaled, A....
Microelectronic Engineering. 107 (2013) - p. 219-222 , 2013

Link: https://doi.org/10.1016/..

15

Effect of the functionalization process on the performance ..:

Khaled, A. ; Raoof, M. ; Cherman, V....
Microelectronics Reliability. 52 (2012) 9-10 - p. 2272-2277 , 2012

Link: https://doi.org/10.1016/..