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Chernobryvko, Mykola
6  Ergebnisse:
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1

Unlocking the True Power of Additive Manufacturing for EMI ..:

Scheibel, Markus G. ; Kaiser, Michael P. ; Balasubramaniam, Sutharsan...
Journal of Microelectronics and Electronic Packaging.  21 (2024)  2 - p. , 2024
Link: https://doi.org/10.4071/..
 
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2

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Chernobryvko, Mykola ; Kaiser, Michael P. ; Murugesan, Kavin Senthil... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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3

Mold based D-band slotted SIW bandpass filter:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Chernobryvko, Mykola ; Kanitkar, Abhijeet ; Muller, Friedrich... - p. 589-592 , 2022
Link: https://doi.org/10.1109/..
 
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4

A Comparative Analysis of Two Dielectric Extraction Methods..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Kanitkar, Abhijeet ; Ndip, Ivan ; Chernobryvko, Mykola... - p. 350-353 , 2022
Link: https://doi.org/10.1109/..
 
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5

High Quality Integrated Inductor in Fan-out Wafer-Level Pac..:

, In: 2020 50th European Microwave Conference (EuMC),
Murugesan, Kavin Senthil ; Chernobryvko, Mykola ; Zinal, Sherko... - p. 89-92 , 2021
Link: https://doi.org/10.23919..
 
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6

Fork-Coupled Resonators for Characterization of Mold Materi..:

, In: 2020 23rd International Microwave and Radar Conference (MIKON),
Kanitkar, Abhijeet ; Chernobryvko, Mykola ; Rossi, Marco... - p. 177-180 , 2020
Link: https://doi.org/10.23919..
 
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