Chery, Emmanuel
92  Ergebnisse:
Personensuche X
?
1

Characterization and Reliability Study of an Al-Doped HfO₂-..:

Chery, Emmanuel ; Croes, Kristof ; Nolmans, Philip.
IEEE Transactions on Electron Devices.  71 (2024)  6 - p. 3845-3851 , 2024
 
?
3

Reliability Investigations of Advanced Photosensitive Polym..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chery, Emmanuel ; Bhatia, Ritwik ; Sundaram, Ganesh.. - p. 647-653 , 2024
 
?
4

Inorganic capping layers in advanced photosensitive polymer..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Pinho, Nelson ; Chery, Emmanuel ; Bhatia, Ritwik... - p. 2040-2045 , 2023
 
?
5

Reliability Investigations of Polymer Based Redistribution ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kwak, Ji-Youn ; Chery, Emmanuel ; Bertheau, Julien... - p. 1080-1084 , 2023
 
?
6

Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Pinho, Nelson ; Chery, Emmanuel ; Pantano, Nicolas... - p. 1364-1368 , 2023
 
?
7

Reliability Challenges in Advanced 3D Technologies: The Cas..:

Chery, Emmanuel ; Fohn, Corinna ; Messemaeker, Joke De.
IEEE Transactions on Device and Materials Reliability.  23 (2023)  4 - p. 615-622 , 2023
 
?
9

The Challenges and Solutions of Cu/SiCN Wafer-to-Wafer Hybr..:

, In: 2023 International Electron Devices Meeting (IEDM),
 
?
10

Investigating the Efficacy of Hafnium Dioxide Barrier Layer..:

Brady-Boyd, Anita ; Chery, Emmanuel ; Armini, Silvia
The Journal of Physical Chemistry Letters.  13 (2022)  34 - p. 8130-8133 , 2022
 
?
11

Broadband Characterization of Polymers under Reliability St..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
?
13

Photosensitive polymer reliability for fine pitch RDL appli..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
?
14

Extreme Wafer Thinning and nano-TSV processing for 3D Heter..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
1-15