E-LIB Suche - Ergebnisse für: Cheung, Yiu Ming

1

Physiological concentration of protocatechuic acid directly..:

Chook, Chui Yiu Bamboo ; Cheung, Yiu Ming ; Ma, Ka Ying...
Frontiers in Nutrition. 10 (2023) - p. , 2023

2

Cardiovascular Outcomes and Hospitalizations in Asian Patie..:

Chan, Jeffrey Shi Kai ; Lakhani, Ishan ; Lee, Teddy Tai Loy...
Current Problems in Cardiology. 48 (2023) 1 - p. 101380 , 2023

Link: https://doi.org/10.1016/..

3

Surface Energy Characterization for Die-Level Cu Hybrid Bon..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Sakuma, Katsuyuki ; Yu, Roy ; Belyansky, Michael... - p. 312-316 , 2022

Link: https://doi.org/10.1109/..

4

REV-ERBα agonist SR9009 suppresses IL-1β production in macr..:

Hong, Huiling ; Cheung, Yiu Ming ; Cao, Xiaoyun...
Biochemical Pharmacology. 192 (2021) - p. 114701 , 2021

Link: https://doi.org/10.1016/..

5

Stencil printing of underfill for flip chips on organic-pan..:

, In: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC),

Lau, John H. ; Zhang, Qinglong ; Li, Ming... - p. 168-174 , 2015

Link: https://doi.org/10.1109/..

6

Improving clustering with pairwise constraints: a discrimin..:

Zeng, Hong ; Song, Aiguo ; Cheung, Yiu Ming
Knowledge and Information Systems. 36 (2012) 2 - p. 489-515 , 2012

Link: https://doi.org/10.1007/..

7

Room-Temperature Ultrasonic Bonding of Semiconductor Thin-D..:

Wong, Sui Yin ; Or, Siu Wing ; Wong, Ho Chi..
Japanese Journal of Applied Physics. 48 (2009) 7 - p. 07GM19 , 2009

Link: https://doi.org/10.1143/..

8

Effects of bonding frequency on Au wedge wire bondability:

Chan, Yu Hin ; Kim, Jang-Kyo ; Liu, Deming...
Journal of Materials Science: Materials in Electronics. 19 (2007) 3 - p. 281-288 , 2007

Link: https://doi.org/10.1007/..

9

Comparative performance of gold wire bonding on rigid and f..:

Chan, Yu Hin ; Kim, Jang-Kyo ; Liu, Deming...
Journal of Materials Science: Materials in Electronics. 17 (2006) 8 - p. 597-606 , 2006

Link: https://doi.org/10.1007/..

10

Process windows for low-temperature Au wire bonding:

Chan, Yu Hin ; Kim, Jang-Kyo ; Liu, Deming...
Journal of Electronic Materials. 33 (2004) 2 - p. 146-155 , 2004

Link: https://doi.org/10.1007/..

11

Effect of tool drop on the performance of a high-frequency ..:

Or, Siu Wing ; Chan, Helen Laiwah ; Cheng, Kei Chun...
Ferroelectrics. 232 (1999) 1 - p. 217-222 , 1999

Link: https://doi.org/10.1080/..

12

Compact Neural Network via Stacking Hybrid Units:

Lan, Weichao ; Cheung, Yiu-Ming ; Jiang, Juyong..
IEEE Transactions on Pattern Analysis and Machine Intelligence. 46 (2024) 1 - p. 103-116 , 2024

Link: https://doi.org/10.1109/..

13

Partial Multilabel Learning Using Noise-Tolerant Broad Lear..:

Qian, Wenbin ; Tu, Yanqiang ; Huang, Jintao..
IEEE Transactions on Neural Networks and Learning Systems. , 2024

Link: https://doi.org/10.1109/..

14

Towards Efficient Cross-Modal Anomaly Detection Using Tripl..:

Peng, Shu-Juan ; Fan, Ye ; Cheung, Yiu-ming...
IEEE Transactions on Emerging Topics in Computational Intelligence. 8 (2024) 1 - p. 697-709 , 2024

Link: https://doi.org/10.1109/..

15

Lossless Data Hiding in NTRU Cryptosystem by Polynomial Enc..:

Wu, Hao-Tian ; Cheung, Yiu-Ming ; Tian, Zhihong...
IEEE Transactions on Information Forensics and Security. 19 (2024) - p. 3719-3732 , 2024

Link: https://doi.org/10.1109/..