E-LIB Suche - Ergebnisse für: Chew, Soon-Aik

1

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 n..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Zhang, Boyao ; Chew, Soon-Aik ; Stucchi, Michele... - p. 312-318 , 2024

Link: https://doi.org/10.1109/..

2

Exploring Bonding Mechanism of SiCN for Hybrid Bonding:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Ebiko, Sodai ; Iacovo, Serena ; Chew, Soon-Aik... - p. 1953-1957 , 2024

Link: https://doi.org/10.1109/..

3

The Challenges and Solutions of Cu/SiCN Wafer-to-Wafer Hybr..:

, In: 2023 International Electron Devices Meeting (IEDM),

Chew, Soon-Aik ; Zhang, Boyao ; Vanstreels, Kris... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

4

700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Chew, Soon-Aik ; Iacovo, Serena ; Fordor, Ferenc... - p. 334-337 , 2022

Link: https://doi.org/10.1109/..

5

RF modelling and characterization of TSVs and inductive lin..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Sun, Xiao ; Su, Chin-Ya ; chen, Shih-Hung... - p. 754-759 , 2024

Link: https://doi.org/10.1109/..

6

3D Simulation for Melt Laser Anneal Integration in FinFET's..:

Tabata, Toshiyuki ; Curvers, Benoit ; Huet, Karim...
IEEE Journal of the Electron Devices Society. 8 (2020) - p. 1323-1327 , 2020

Link: https://doi.org/10.1109/..

7

(Invited) Gate-All-Around Transistors Based on Vertically S..:

Mertens, Hans ; Ritzenthaler, Romain ; Hikavyy, Andriy Yakovitch...
ECS Transactions. 77 (2017) 5 - p. 19-30 , 2017

Link: https://doi.org/10.1149/..

8

Thermal and plasma treatments for improved (sub-)1 nm equiv..:

Veloso, Anabela ; Boccardi, Guillaume ; Ragnarsson, Lars-Åke...
Japanese Journal of Applied Physics. 53 (2014) 4S - p. 04EA04 , 2014

Link: https://doi.org/10.7567/..

9

W versus Co–Al as Gate Fill-Metal for Aggressively Scaled R..:

Veloso, Anabela ; Chew, Soon Aik ; Schram, Tom...
Japanese Journal of Applied Physics. 52 (2013) 4S - p. 04CA03 , 2013

Link: https://doi.org/10.7567/..

10

Integration Challenges and Options of Replacement High-κ/Me..:

Veloso, Anabela ; Ragnarsson, Lars-Åke ; Schram, Tom...
ECS Transactions. 52 (2013) 1 - p. 385-390 , 2013

Link: https://doi.org/10.1149/..

11

Effective Work Function Engineering for Aggressively Scaled..:

Veloso, Anabela ; Chew, Soon Aik ; Higuchi, Yuichi...
Japanese Journal of Applied Physics. 52 (2013) 4S - p. 04CA02 , 2013

Link: https://doi.org/10.7567/..

12

Process Optimization of p+LDD in 130nm Process Technology u..:

, In: 2006 IEEE International Conference on Semiconductor Electronics,

Abd Majid, Hani Noorashiqin ; Muhamad, Muhamad Rasat ; Kordesch, Albert Victor. - p. None , 2006

Link: https://doi.org/10.1109/..

13

3D Simulation for Melt Laser Anneal Integration in FinFET's..:

Toshiyuki Tabata ; Benoit Curvers ; Karim Huet...
https://ieeexplore.ieee.org/document/9223740/. , 2020

Link: https://doi.org/10.1109/..

14

Constructing an Art-Life: Tourism and Street Art in Sarawak:

, In: Contemporary Asian Artistic Expressions and Tourism; Perspectives on Asian Tourism,

Ng, Ian Aik-Soon - p. 59-101 , 2020

Link: https://doi.org/10.1007/..

15

P3‐284: UTILITY OF SELF‐RATED AD8 FOR DETECTION OF EARLY CO..:

Win, Khin Khin ; Chew, Justin Linghui ; Lim, Jun Pei...
Alzheimer's & Dementia. 15 (2019) 7S_Part_20 - p. , 2019

Link: https://doi.org/10.1016/..