Chhun, S.
37  Ergebnisse:
Personensuche X
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1

Immunological and virological profile of children with chil..:

Fertitta, L. ; Welfringer‐Morin, A. ; Ouedrani, A....
Journal of the European Academy of Dermatology and Venereology.  35 (2020)  3 - p. , 2020
 
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2

Pseudo-engelures de l'enfant et SARS-CoV-2 : quel lien ?:

Fertitta, L. ; Welfringer, A. ; Polivka, L....
Annales de Dermatologie et de Vénéréologie.  147 (2020)  12 - p. A196-A197 , 2020
 
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4

14nm FDSOI technology for high speed and energy efficient a..:

, In: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers,
Weber, O. ; Josse, E. ; Andrieu, F.... - p. 1-2 , 2014
 
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6

New generation of Self Ionized Plasma copper seed for sub 4..:

Guillan, J. ; Haxaire, K. ; Chhun, S....
Microelectronic Engineering.  88 (2011)  5 - p. 697-700 , 2011
 
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8

32nm node BEOL integration with an extreme low-k porous SiO..:

Hamioud, K. ; Arnal, V. ; Farcy, A....
Microelectronic Engineering.  87 (2010)  3 - p. 316-320 , 2010
 
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9

Demonstration of TFHM scalability to 32 nm node BEOL interc..:

, In: 2009 IEEE International Interconnect Technology Conference,
Hamioud, K. ; Arnal, V. ; Farcy, A.... - p. None , 2009
 
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10

Validation of an HPLC-UV method for sorafenib determination..:

Blanchet, B. ; Billemont, B. ; Cramard, J....
Journal of Pharmaceutical and Biomedical Analysis.  49 (2009)  4 - p. 1109-1114 , 2009
 
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11

Population analysis of the pregnancy-related modifications ..:

Bouillon-Pichault, M. ; Jullien, V. ; Azria, E....
Journal of Antimicrobial Chemotherapy.  63 (2009)  6 - p. 1223-1232 , 2009
 
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13

Simultaneous determination of three carbapenem antibiotics ..:

LEGRAND, T ; CHHUN, S ; REY, E...
Journal of Chromatography B.  875 (2008)  2 - p. 551-556 , 2008
 
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14

Cu surface treatment influence on Si adsorption properties ..:

Chhun, S. ; Gosset, L.G. ; Michelon, J....
Microelectronic Engineering.  83 (2006)  11-12 - p. 2094-2100 , 2006
 
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15

Characterization of electrical and crystallographic propert..:

Gaillard, N. ; Mariolle, D. ; Bertin, F....
Microelectronic Engineering.  83 (2006)  11-12 - p. 2169-2174 , 2006
 
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