Chi, Chun-Chuan
8543  Ergebnisse:
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1

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive ..:

Chi, Chun-Chuan ; Marinissen, Erik Jan ; Goel, Sandeep Kumar.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  22 (2014)  11 - p. 2388-2401 , 2014
 
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3

A low-cost wireless interface with no external antenna and ..:

, In: Proceedings of the 48th Design Automation Conference,
Li, Chin-Fu ; Lee, Chi-Ying ; Wang, Chen-Hsing... - p. 771-776 , 2011
 
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7

Failure Mechanisms of High-Voltage Spinel LiNi0.5Mn1.5O4 wi..:

Khotimah, Chusnul ; Wang, Fu-Ming ; Wohlfahrt-Mehrens, Margret...
ACS Sustainable Chemistry & Engineering.  11 (2023)  11 - p. 4374-4388 , 2023
 
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8

Wasabi Component 6-(Methylsulfinyl)hexly Isothiocyanate and..:

Huang, Tun-Sung ; Ko, Chih-Jung ; Lin, Jiunn-Chang...
International Journal of Molecular Sciences.  23 (2022)  15 - p. 8488 , 2022
 
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9

Controlling Ni2+from the Surface to the Bulk by a New Catho..:

Yeh, Nan-Hung ; Wang, Fu-Ming ; Khotimah, Chusnul...
ACS Applied Materials & Interfaces.  13 (2021)  6 - p. 7355-7369 , 2021
 
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10

In Situ Co–O Bond Reinforcement of the Artificial Cathode E..:

Wang, Fu-Ming ; Chemere, Endazenaw Bizuneh ; Chien, Wen-Chen...
ACS Applied Materials & Interfaces.  13 (2021)  39 - p. 46703-46716 , 2021
 
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13

Application of Internet of Things Technology in the Man-Mad..:

, In: Lecture Notes in Civil Engineering; Geotechnics for Sustainable Infrastructure Development,
Tseng, Mei-Chi ; Chi, Po-Chuan ; Wu, Chien-Chun. - p. 1203-1207 , 2019
 
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