Personensuche
X
?
2023 International Conference on Electronics Packaging (ICEP) ,
2
Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrysta..:
, In:
?
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
7
Fabrication and Characterization of Wafer Level Three-Dimen..:
, In:
?
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
14