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X
Chiang, K. N.
7108  Ergebnisse:
Personensuche X
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1

Sensitivity Study of Wafer-Level Packaging Lifetime Predict..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Lee, C. E. ; Yuan, Cadmus ; Chiang, K. N. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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2

The Strategy on Artificial Neural Networks for Predicting A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Su, Qinghua ; Yuan, Cadmus ; Chiang, K.N. - p. 183-184 , 2024
Link: https://doi.org/10.23919..
 
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3

Study on the feasible mesh size control method for WLP 3D f..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Chen, Y. J. ; Yuan, Cadmus ; Chiang, K. N. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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4

Warpage Estimation of Panel-Level Packaging by AI-assisted ..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Chen, Y.C. ; Chiang, K.N. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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5

Combining Process Modeling and Machine Learning Technology ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Y.C. ; Chen, H. L. ; Chiang, K.N. - p. 54-58 , 2023
Link: https://doi.org/10.1109/..
 
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6

Use Artificial Neural Network to fit stress-strain curve of..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lee, C.E. ; Yuan, Cadmus ; Chiang, K.N. - p. 137-142 , 2023
Link: https://doi.org/10.1109/..
 
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7

The Effect of Geometric and Material Uncertainty on Debondi..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Chen, H. L. ; Chiang, K. N. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

Studying Asymmetric Warpage Behavior of Panel-Level Package..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Shu, Z. ; Chiang, K. N. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

Using Grid Search Methods and Parallel Computing to Reduce ..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Chang, C. Y. ; Lee, C. H. ; Chiang, K. N. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

Fitting Solder305 Anand Model Parameters with Artificial Ne..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Su, Qinghua ; Yuan, Cadmus ; Chiang, K.N. - p. 143-147 , 2023
Link: https://doi.org/10.1109/..
 
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11

Using Extra Trees Machine Learning Algorithm to Predict the..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Shu, Z. ; Wang, B. S. ; Chiang, K.N. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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12

Predict the Reliability Life of Wafer Level Packaging using..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, H. L. ; Chen, B.S. ; Chiang, K.N. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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13

The numerical study of mechanical improvement of the metal ..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Sun, P.Y. ; Cadmus C.A., Yuan ; Chiang, K.N. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Investigation of the mechanical characteristics of the Cu/l..:

Yuan, Cadmus C A ; Chang, H M ; Chiang, K N
Journal of Mechanics.  38 (2022)  - p. 539-551 , 2022
Link: https://doi.org/10.1093/..
 
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15

Study on Gaussian Process Regression to Predict Reliability..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chang, C.Y. ; Chang, H. M. ; Chiang, K.N. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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