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Chien, Heng-Chieh
3640  Ergebnisse:
Personensuche X
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1

High-performance electrodeposited copper wicks for heat-spr..:

Yu, Jui-Cheng ; Chien, Heng-Chieh ; Chiang, Chao-Yang...
Applied Thermal Engineering.  228 (2023)  - p. 120495 , 2023
Link: https://doi.org/10.1016/..
 
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2

Thermal performance analysis of a package using non-simulat..:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chien, Heng-Chieh ; Huang, Mei-Jiau ; Chen, Zheng-Zhun - p. 76-77 , 2020
Link: https://doi.org/10.1109/..
 
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3

Thermal spreading resistance of heat sources on rectangular..:

Huang, Mei-Jiau ; Shaw, You-Rong ; Chien, Heng-Chieh
International Journal of Thermal Sciences.  145 (2019)  - p. 105979 , 2019
Link: https://doi.org/10.1016/..
 
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4

Annealing effects on the thermoelectric properties of silve..:

Lin, Jyun-Min ; Chen, Ying-Chung ; Lin, Chi-Pi...
Microelectronic Engineering.  148 (2015)  - p. 51-54 , 2015
Link: https://doi.org/10.1016/..
 
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5

Thermal conductivity of thermoelectric thick films prepared..:

Chien, Heng-Chieh ; Yang, Chii-Rong ; Liao, Li-Ling...
Applied Thermal Engineering.  51 (2013)  1-2 - p. 75-83 , 2013
Link: https://doi.org/10.1016/..
 
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6

Evaluation of Temperature-Dependent Effective Material Prop..:

Chien, Heng-Chieh ; Chu, En-Ting ; Hsieh, Huey-Lin...
Journal of Electronic Materials.  42 (2013)  7 - p. 2362-2370 , 2013
Link: https://doi.org/10.1007/..
 
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7

Thermal Performance of 3D IC Package with Embedded TSVs:

Tain, Ra-Min ; Dai, Ming-Ji ; Chao, Yu-Lin...
Transactions of The Japan Institute of Electronics Packaging.  5 (2012)  1 - p. 75-84 , 2012
Link: https://doi.org/10.5104/..
 
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8

Measurement and evaluation of the interfacial thermal resis..:

Chien, Heng-Chieh ; Yao, Da-Jeng ; Hsu, Cheng-Ting
Applied Physics Letters.  93 (2008)  23 - p. , 2008
Link: https://doi.org/10.1063/..
 
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9

Thermal conductivity of Si/SiGe superlattice films:

Liu, Chun-Kai ; Yu, Chih-Kuang ; Chien, Heng-Chieh...
Journal of Applied Physics.  104 (2008)  11 - p. , 2008
Link: https://doi.org/10.1063/..
 
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10

Thermal conductivity measurement and interface thermal resi..:

Chien, Heng-Chieh ; Yao, Da-Jeng ; Huang, Mei-Jiau.
Review of Scientific Instruments.  79 (2008)  5 - p. , 2008
Link: https://doi.org/10.1063/..
 
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11

Physical reservoirs based on MoS2–HZO integrated ferroelect..:

Li, Lingqi ; Xiang, Heng ; Zheng, Haofei...
Nanoscale Horizons.  9 (2024)  5 - p. 752-763 , 2024
Link: https://doi.org/10.1039/..
 
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12

Novel Mos2 Dual-Gate FET with a Highly Scaled EOT of ~2.4 n..:

, In: 2023 Silicon Nanoelectronics Workshop (SNW),
Li, Lingqi ; Zheng, Haofei ; Xiang, Heng.. - p. 105-106 , 2023
Link: https://doi.org/10.23919..
 
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13

Dynamic Ferroelectric Transistor‐Based Reservoir Computing ..:

Duong, Ngoc Thanh ; Chien, Yu-Chieh ; Xiang, Heng...
Advanced Intelligent Systems.  5 (2023)  6 - p. , 2023
Link: https://doi.org/10.1002/..
 
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14

2022 Taiwan lipid guidelines for primary prevention:

Huang, Po-Hsun ; Lu, Ya-Wen ; Tsai, Yi-Lin...
Journal of the Formosan Medical Association.  121 (2022)  12 - p. 2393-2407 , 2022
Link: https://doi.org/10.1016/..
 
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15

Application of 2D Materials in Hardware Security for Intern..:

Xiang, Heng ; Chien, Yu-Chieh ; Shi, Yufei.
Small Structures.  3 (2022)  8 - p. , 2022
Link: https://doi.org/10.1002/..
 
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