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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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The Phenomenon of Tunnel Structure Mold Flowability Experim..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Simulation of Solder Crack Phenomenon in Molding Process:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
3
Optimization of Process Parameters for Molding Simulation o..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
Simulation of the Filler Stuck Mechanism in Molding Process..:
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2020 IEEE International Conference on Robotics and Automation (ICRA) ,
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Velocity Field based Active-Assistive Control for Upper Lim..:
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2019 IEEE International Conference on Robotics and Biomimetics (ROBIO) ,
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