Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Chiu, Tsung-Chieh
2484  Ergebnisse:
Personensuche X
?
1

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
?
2

Softening of Micro Sn Electrodeposit by Polyethylene Glycol..:

Chiu, Tsung-Chieh ; Chiu, Ying-Ta ; Lin, Kwang-Lung
ECS Journal of Solid State Science and Technology.  7 (2018)  3 - p. P109-P113 , 2018
Link: https://doi.org/10.1149/..
 
?
3

Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni so..:

Lin, Chen-Yi ; Chiu, Tsung-Chieh ; Lin, Kwang-Lung
Journal of Applied Physics.  123 (2018)  11 - p. , 2018
Link: https://doi.org/10.1063/..
 
?
4

Current induced segregation of intermetallic compounds in t..:

Chen, Chiao-Wen ; Chiu, Tsung-Chieh ; Chiu, Ying-Ta..
Intermetallics.  85 (2017)  - p. 117-124 , 2017
Link: https://doi.org/10.1016/..
 
?
5

Current induced rapid phase transformation in Au/Sn reactio..:

Chiu, Tsung-Chieh ; Lin, Kwang-Lung
Journal of Alloys and Compounds.  712 (2017)  - p. 111-120 , 2017
Link: https://doi.org/10.1016/..
 
?
6

Electro-dissolution of the Bi second phase in Sn5Bi solder ..:

Chiu, Tsung-Chieh ; Chiu, Ying-Ta ; Lin, Kwang-Lung
Materials Letters.  160 (2015)  - p. 309-313 , 2015
Link: https://doi.org/10.1016/..
 
?
7

Anisotropic dissolution behavior of the second phase in SnC..:

Chen, Wei-Yu ; Chiu, Tsung-Chieh ; Lin, Kwang-Lung...
Scripta Materialia.  68 (2013)  5 - p. 317-320 , 2013
Link: https://doi.org/10.1016/..
 
?
8

The growth of intermetallic compound in Cu/Sn3.5Ag/Au solde..:

Chiu, Tsung-Chieh ; Lin, Kwang-Lung
Intermetallics.  23 (2012)  - p. 208-216 , 2012
Link: https://doi.org/10.1016/..
 
?
9

Electrorecrystallization of intermetallic compound in the S..:

Chen, Wei-Yu ; Chiu, Tsung-Chieh ; Lin, Kwang-Lung.
Intermetallics.  26 (2012)  - p. 40-43 , 2012
Link: https://doi.org/10.1016/..
 
?
10

Effect of thermal cycling on the adhesion strength of Ti/Ni..:

Jang, Wei-Luen ; Chiu, Tsung-Chieh ; Lin, Kwang-Lung
Thin Solid Films.  519 (2011)  16 - p. 5539-5543 , 2011
Link: https://doi.org/10.1016/..
 
?
11

The difference in the types of intermetallic compound forme..:

Chiu, Tsung-Chieh ; Lin, Kwang-Lung
Intermetallics.  17 (2009)  12 - p. 1105-1114 , 2009
Link: https://doi.org/10.1016/..
 
?
12

The growth of Sn whiskers with dislocation inclusion upon e..:

Chiu, Tsung-Chieh ; Lin, Kwang-Lung
Scripta Materialia.  60 (2009)  12 - p. 1121-1124 , 2009
Link: https://doi.org/10.1016/..
 
?
13

Electromigration behavior of the Cu/Au/SnAgCu/Cu solder com..:

Chiu, Tsung-Chieh ; Lin, Kwang-Lung
Journal of Materials Research.  23 (2008)  1 - p. 264-273 , 2008
Link: https://doi.org/10.1557/..
 
?
14

Amperometric detection of bilirubin from a micro-sensing el..:

Syu, Mei-Jywan ; Chiu, Tsung-Chieh ; Lai, Chune-You.
Biosensors and Bioelectronics.  22 (2006)  4 - p. 550-557 , 2006
Link: https://doi.org/10.1016/..
 
?
15

Binding specificity of α-bilirubin-imprinted poly(methacryl..:

Syu, Mei-Jywan ; Deng, Jing-Hong ; Nian, You-Ming..
Biomaterials.  26 (2005)  22 - p. 4684-4692 , 2005
Link: https://doi.org/10.1016/..
 
1-15