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2024 International Conference on Electronics Packaging (ICEP) ,
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Carbon/Nitrogen Dual-Doped inP-Type Silicon Hard Mask for W..:
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2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) ,
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Boron Ion Implantation-Induced Embedded Layers for Ultra-Th..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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