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2024 International Conference on Electronics Packaging (ICEP) ,
4
Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding:
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2024 International Conference on Electronics Packaging (ICEP) ,
7
Optimization of O2 Plasma Treatment on Cu Surface for Hybri..:
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Proceedings of the CHI Conference on Human Factors in Computing Systems ,
12
FLUID-IoT : Flexible and Fine-Grained Access Control in Sha..:
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2024 IEEE International Conference on Communications Workshops (ICC Workshops) ,
13
Adaptive Transit Control with Crowd Density Estimation for ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
14