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Chong, Ser Choong
228  Ergebnisse:
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1

Dielectric Stack Optimization for Die-level Warpage Reducti..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Rao, B.S.S. Chandra ; Kumar, Mishra Dileep ; Sekhar, Vasarla Nagendra... - p. 62-68 , 2024
Link: https://doi.org/10.1109/..
 
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2

Multi-Chip Stacked Memory Module Development using Chip to ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sekhar, Vasarla Nagendra ; Kumar, Mishra Dileep ; Tippabhotla, Sasi Kumar... - p. 2024-2030 , 2024
Link: https://doi.org/10.1109/..
 
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3

Development of Flip-Chip Packaging for Monolithic Microwave..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Wai, Leong Ching ; Guan Lim, Teck ; Chong, Ser Choong. - p. 455-458 , 2023
Link: https://doi.org/10.1109/..
 
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4

Reliability Assessment of 2.5D Module using Chip to Wafer H..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chong, Ser Choong ; Au Keng Yuen, Jason ; Sekhar, Vasarla Nagendra... - p. 425-429 , 2023
Link: https://doi.org/10.1109/..
 
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5

Development of 4 die stack module using Hybrid bonding appr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chong, Ser Choong ; Keng Yuen, Jason Au ; Sekhar, Vasarla Nagendra.. - p. 788-794 , 2023
Link: https://doi.org/10.1109/..
 
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6

Efficient and Adaptive Semantic Segmentation of HBMs using ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chang, Richard ; Thakur, Namrata ; Wang, Jie... - p. 938-943 , 2023
Link: https://doi.org/10.1109/..
 
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7

Development of Chip to Wafer Assembly with CuSnAg Microbump..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Keng Yuen, Jason Au ; Chong, Ser Choong ; Daniel, Ismael Cereno - p. 94-99 , 2023
Link: https://doi.org/10.1109/..
 
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8

Cu Damascene Process on Temporary Bonded Wafers for Thin Ch..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sekhar, Vasarla Nagendra ; Kumar, Mishra Dileep ; Lianto, Prayudi.. - p. 564-570 , 2023
Link: https://doi.org/10.1109/..
 
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9

Attachment of Alignment Fibre on Interposer for Fibre Optic..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Wai, Leong Ching ; Lim, Teck Guan ; Chong, Ser Choong. - p. 128-133 , 2022
Link: https://doi.org/10.1109/..
 
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10

Assembly challenges and demonstrations of ultra-large Anten..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Wee, David Ho Soon. - p. 635-642 , 2022
Link: https://doi.org/10.1109/..
 
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11

Chip-to-Wafer Hybrid Bonding for high performance 2.5D appl..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chong, Ser Choong ; Daniel, Ismael Cereno ; Sekhar, Vasarla Nagendra.. - p. 19-23 , 2022
Link: https://doi.org/10.1109/..
 
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12

Comprehensive Study on Die Shift with Ultra-Large Embedded ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Seit, Wen Wei ; Chong, Ser Choong ; Lim, Sharon. - p. 150-155 , 2022
Link: https://doi.org/10.1109/..
 
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13

Comprehensive study on effect of chip layout and mold thick..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Seit, Wen Wei... - p. 945-950 , 2022
Link: https://doi.org/10.1109/..
 
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14

Development of wafer level solderball placement process for..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Jaafar, Norhanani ; Chong, Ser Choong.. - p. 435-439 , 2020
Link: https://doi.org/10.1109/..
 
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15

Demonstration of Vertically Integrated POP using FOWLP Appr..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Ser Choong ; Wai Leong Ching, Eva ; Pei Siang, Sharon Lim.. - p. 873-878 , 2020
Link: https://doi.org/10.1109/..
 
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