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Proceedings of the 2024 International Symposium on Physical Design ,
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Warpage Study by Employing an Advanced Simulation Methodolo..:
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Proceedings of the 2022 International Symposium on Physical Design ,
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Novel Methodology for Assessing Chip-Package Interaction Ef..:
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2019 International 3D Systems Integration Conference (3DIC) ,
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An Accurate Assessment of Chip-Package Interaction is a Key..:
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Proceedings of the 2014 IEEE/ACM International Conference on Computer-Aided Design ,
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Accurate full-chip estimation of power map, current densiti..:
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2009 10th International Symposium on Quality Electronic Design ,
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