Choy, Jun-Ho
867  Ergebnisse:
Personensuche X
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1

Warpage Study by Employing an Advanced Simulation Methodolo..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
 
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2

Novel Methodology for Assessing Chip-Package Interaction Ef..:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Kteyan, Armen ; Choy, Jun-Ho ; Sukharev, Valeriy... - p. 83-89 , 2022
 
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3

Experimental Validation of a Novel Methodology for Electrom..:

Sukharev, Valeriy ; Kteyan, Armen ; Najm, Farid N....
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  41 (2022)  11 - p. 4837-4850 , 2022
 
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4

An Accurate Assessment of Chip-Package Interaction is a Key..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
 
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6

Accurate full-chip estimation of power map, current densiti..:

, In: Proceedings of the 2014 IEEE/ACM International Conference on Computer-Aided Design,
Chew, Marko ; Aslyan, Ara ; Choy, Jun-ho. - p. 440-445 , 2014
 
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8

Control of design specific variation in etch-assisted via p..:

, In: 2009 10th International Symposium on Quality Electronic Design,
 
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10

Process optimization of polymetal (W/WN/Polysilicon) gate a..:

Shim, Pil Bo ; Choy, Jun-Ho ; Gil, Gyung Sun..
Journal of Electronic Materials.  31 (2002)  10 - p. 988-993 , 2002
 
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11

Impact of Polymetal Gate Etch Post-Cleaning on Data Retenti..:

Kim, Nam-Sung ; Kim, Il-Gweon ; Choy, Jun-Ho.
Japanese Journal of Applied Physics.  41 (2002)  Part 1, No. 4B - p. 2385-2389 , 2002
 
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12

Anomalous scaling effect of tungsten/titanium nitride/titan..:

Choy, Jun-Ho ; Kim, Young-Soo ; Hwang, Tae-Keun...
Journal of Electronic Materials.  30 (2001)  12 - p. 1609-1615 , 2001
 
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13

On the shape evolution of a two-dimensional coherent precip..:

Choy, Jun-Ho ; Lee, Jong K.
Materials Science and Engineering: A.  285 (2000)  1-2 - p. 195-206 , 2000
 
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