Chua, Kok Keng
333  Ergebnisse:
Personensuche X
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1

Non-destructive fault isolation in through-silicon interpos..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
 
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2

Defect Localization in Through-Si-Interposer Based 2.5D ICs:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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3

Robust Package Development for Automotive Application:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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4

Enhanced Package Fault Isolation Method Using Time Domain R..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Lee, Lan Yin ; Keng Chua, Kok - p. 1-3 , 2019
 
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10

Assessment of the Efficacy of EEG-Based MI-BCI With Visual ..:

Foong, Ruyi ; Ang, Kai Keng ; Quek, Chai...
IEEE Transactions on Biomedical Engineering.  67 (2020)  3 - p. 786-795 , 2020
 
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11

Facilitating motor imagery-based brain–computer interface f..:

Arvaneh, Mahnaz ; Guan, Cuntai ; Ang, Kai Keng...
Neural Computing and Applications.  28 (2016)  11 - p. 3259-3272 , 2016
 
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14

Resting State Changes in Functional Connectivity Correlate ..:

Várkuti, Bálint ; Guan, Cuntai ; Pan, Yaozhang...
Neurorehabilitation and Neural Repair.  27 (2012)  1 - p. 53-62 , 2012
 
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