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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
1
Non-destructive fault isolation in through-silicon interpos..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
2
Defect Localization in Through-Si-Interposer Based 2.5D ICs:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
3
Robust Package Development for Automotive Application:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
4