Chue, Ching-Hwei
43  Ergebnisse:
Personensuche X
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2

Heat conduction in a functionally graded medium with an arb..:

Chiu, Tz-Cheng ; Tsai, Shang-Wu ; Chue, Ching-Hwei
International Journal of Heat and Mass Transfer.  67 (2013)  - p. 514-522 , 2013
 
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3

Mode III fracture problem of an FGPM strip bonded to an FGP..:

Yeh, Chien-Nan ; Chue, Ching-Hwei
Journal of the Chinese Institute of Engineers.  35 (2012)  2 - p. 193-209 , 2012
 
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5

Mode III fracture problem of a cracked FGPM surface layer b..:

Chen, Yen-Ji ; Chue, Ching-Hwei
Archive of Applied Mechanics.  80 (2009)  3 - p. 285-305 , 2009
 
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6

Mode III crack problems of two bonded functionally graded s..:

Chen, Yen-Ji ; Chue, Ching-Hwei
International Journal of Solids and Structures.  46 (2009)  2 - p. 331-343 , 2009
 
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8

Mode III fracture problem of an arbitrarily oriented crack ..:

Hsu, Wei-Hung ; Chue, Ching-Hwei
International Journal of Solids and Structures.  45 (2008)  25-26 - p. 6333-6346 , 2008
 
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9

Antiplane electro-mechanical field of a piezoelectric finit..:

Chue, Ching-Hwei ; Liu, Wei-Ju
International Journal of Solids and Structures.  44 (2007)  7-8 - p. 2540-2552 , 2007
 
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10

Electroelastic analysis of a piezoelectric finite wedge wit..:

Liu, Wei-Ju ; Chue, Ching-Hwei
Theoretical and Applied Fracture Mechanics.  48 (2007)  3 - p. 203-224 , 2007
 
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13

Mode III eccentric crack in a functionally graded piezoelec..:

Ou, Yi-Liang ; Chue, Ching-Hwei
International Journal of Solids and Structures.  43 (2006)  20 - p. 6148-6164 , 2006
 
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15

Two mode III internal cracks located within two bonded func..:

Ou, Yi-Liang ; Chue, Ching-Hwei
Archive of Applied Mechanics.  75 (2006)  6-7 - p. 364-378 , 2006
 
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