E-LIB Suche - Ergebnisse für: Chung, Min-Hua

1

Solder joint reliability performance study and shear charac..:

Liu, Vance ; Zou, Yung-Sheng ; Chen, Yi-Yu...
Materials Science in Semiconductor Processing. 179 (2024) - p. 108489 , 2024

Link: https://doi.org/10.1016/..

2

Tombstoning Investigation of Ultra-small Chip Passive Compo..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),

Hsu, Yun-Ting ; Zou, Yung-Sheng ; Chung, Min-Hua... - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

3

Evolution of epoxy molding compounds and future carbon mate..:

Gan, Chong Leong ; Chung, Min-Hua ; Lin, Lu-Fu..
Journal of Materials Science: Materials in Electronics. 34 (2023) 30 - p. , 2023

Link: https://doi.org/10.1007/..

4

Technological sustainable materials and enabling in semicon..:

Gan, Chong Leong ; Chung, Min-Hua ; Zou, Yung-Sheng..
e-Prime - Advances in Electrical Engineering, Electronics and Energy. 5 (2023) - p. 100245 , 2023

Link: https://doi.org/10.1016/..

5

Investigation of Bi and In Elemental Addition in Solder Pas..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Hsu, Yun-Ting ; Zou, Yung-Sheng ; Chen, Yi-Yu... - p. 211-212 , 2023

Link: https://doi.org/10.23919..

6

Study of robust package strength characterization of memory..:

Liu, Vance ; Chen, Chien-Ming ; Chen, Joyce..
Memories - Materials, Devices, Circuits and Systems. 3 (2022) - p. 100018 , 2022

Link: https://doi.org/10.1016/..

7

Case study of large-scale levee failures induced by cyclic ..:

Tsai, Chi-Chin ; Yang, Zi-Xian ; Chung, Min-Hua.
Engineering Geology. 297 (2022) - p. 106518 , 2022

Link: https://doi.org/10.1016/..

8

A review of interconnect materials used in emerging memory ..:

Zou, Yong Sheng ; Gan, Chong Leong ; Chung, Min-Hua.
Journal of Materials Science: Materials in Electronics. 32 (2021) 23 - p. 27133-27147 , 2021

Link: https://doi.org/10.1007/..

9

Silane modification on mesoporous silica coated carbon nano..:

Chung, Min-Hua ; Wang, Wei-Hsiang ; Chen, Li-Ming...
Composites Part A: Applied Science and Manufacturing. 78 (2015) - p. 1-9 , 2015

Link: https://doi.org/10.1016/..

10

Effects of mesoporous silica coated multi-wall carbon nanot..:

Chung, Min-Hua ; Chen, Li-Ming ; Wang, Wei-Hsiang...
Journal of the Taiwan Institute of Chemical Engineers. 45 (2014) 5 - p. 2813-2819 , 2014

Link: https://doi.org/10.1016/..

11

A review on future novel interconnect and polymeric materia..:

Gan, C. L. ; Huang, Chen Yu ; Zou, Yung Sheng..
Journal of Materials Science: Materials in Electronics. 34 (2023) 29 - p. , 2023

Link: https://doi.org/10.1007/..

12

Effectiveness of Slow Cure Non-Conductive Film in Void elim..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Jao, Li ; Lai, Ming Hung ; Kr, Sareddy... - p. 490-492 , 2022

Link: https://doi.org/10.1109/..

13

Sleep stage classification using Light Gradient Boost Machi..:

Tai, Chih-Hua ; Liao, Ting-Yi ; Chen, Shi-Pin.
Biomedical Signal Processing and Control. 88 (2024) - p. 105647 , 2024

Link: https://doi.org/10.1016/..

14

Pulse pressure is associated with decline in physical funct..:

Chuang, Shao-Yuan ; Liu, Wen-Ling ; Cheng, Hao-Min...
Maturitas. 185 (2024) - p. 108000 , 2024

Link: https://doi.org/10.1016/..

15

Classifying Alzheimer's disease and normal subjects using m..:

Huang, Yu-Hua ; Chen, Yi-Chun ; Ho, Wei-Min...
Journal of the Formosan Medical Association. 123 (2024) 6 - p. 701-709 , 2024

Link: https://doi.org/10.1016/..