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Dchar, Ilyas
30  Ergebnisse:
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1

Die Tilt Improvement Through Copper Spacers in Solder Paste..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Santican, Haima ; Dchar, Ilyas ; Yandoc, Ding.. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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2

Effect of Die Thickness on the Reliability of Solder Joint ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Dchar, Ilyas ; Yandoc, Ding - p. 776-779 , 2022
Link: https://doi.org/10.1109/..
 
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3

SiC power devices packaging with a short-circuit failure mo..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
Microelectronics Reliability.  76-77 (2017)  - p. 400-404 , 2017
Link: https://doi.org/10.1016/..
 
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4

Avalanche robustness of SiC Schottky diode:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
Microelectronics Reliability.  64 (2016)  - p. 494-501 , 2016
Link: https://doi.org/10.1016/..
 
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5

Packaging Solution for SiC Power Modules with a Fail-to-Sho..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
info:eu-repo/semantics/altIdentifier/doi/10.1109/APEC.2019.8722126.  , 2019
Link: https://hal.science/hal-..
 
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6

Packaging Solution for SiC Power Modules with a Fail-to-Sho..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
info:eu-repo/semantics/altIdentifier/doi/10.1109/APEC.2019.8722126.  , 2019
Link: https://hal.science/hal-..
 
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7

Packaging Solution for SiC Power Modules with a Fail-to-Sho..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
info:eu-repo/semantics/altIdentifier/doi/10.1109/APEC.2019.8722126.  , 2019
Link: https://hal.science/hal-..
 
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8

Packaging Solution for SiC Power Modules with a Fail-to-Sho..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
hal-02076181.  , 2019
Link: https://hal.archives-ouv..
 
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9

Packaging Solution for SiC Power Modules with a Fail-to-Sho..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
info:eu-repo/semantics/altIdentifier/doi/10.1109/APEC.2019.8722126.  , 2019
Link: https://hal.science/hal-..
 
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10

SiC power devices packaging with a short-circuit failure mo..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.microrel.2017.07.003.  , 2017
Link: https://hal.archives-ouv..
 
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11

Robustness of SiC MOSFET under avalanche conditions:

Dchar, Ilyas ; Zolkos, Marion ; Buttay, Cyril.
info:eu-repo/semantics/altIdentifier/doi/10.1109/APEC.2017.7931015.  , 2017
Link: https://hal.science/hal-..
 
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12

SiC power devices packaging with a short-circuit failure mo..:

Dchar, Ilyas ; Buttay, Cyril ; Morel, Hervé
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.microrel.2017.07.003.  , 2017
Link: https://hal.science/hal-..
 
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13

Designing a power module with failure to short circuit mode..:

Dchar, Ilyas
NNT: 2017LYSEI042.  , 2017
Link: https://theses.hal.scien..
 
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14

Designing a power module with failure to short circuit mode..:

Dchar, Ilyas
NNT: 2017LYSEI042.  , 2017
Link: https://theses.hal.scien..
 
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15

Robustness of SiC MOSFET under avalanche conditions:

Dchar, Ilyas ; Zolkos, Marion ; Buttay, Cyril.
info:eu-repo/semantics/altIdentifier/doi/10.1109/APEC.2017.7931015.  , 2017
Link: https://hal.science/hal-..
 
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