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DeBoi, Brian
21  Ergebnisse:
Personensuche X
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1

A Simple and Non-Destructive Method to Measure Per-Terminal..:

, In: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC),
DeBoi, Brian ; Curbow, Austin ; Lemmon, Andrew - p. 1633-1638 , 2023
Link: https://doi.org/10.1109/..
 
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2

Improved Methodology for Estimating Switching Losses of Wid..:

, In: 2022 IEEE Applied Power Electronics Conference and Exposition (APEC),
Bryant, Briana ; Lemmon, Andrew ; DeBoi, Brian. - p. 915-922 , 2022
Link: https://doi.org/10.1109/..
 
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3

Comprehensive Characterization of MOSFET Intrinsic Capacita..:

, In: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC),
Jimenez, Sergio ; Lemmon, Andrew ; Nelson, Blake. - p. 1524-1530 , 2021
Link: https://doi.org/10.1109/..
 
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4

EMI Evaluation of a SiC MOSFET Module with Organic DBC Subs..:

, In: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC),
Rajagopal, Narayanan ; DiMarino, Christina ; DeBoi, Brian.. - p. 2338-2344 , 2021
Link: https://doi.org/10.1109/..
 
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5

Empirical Procedure for Estimating Mutual Coupling in High-..:

, In: 2021 IEEE Electric Ship Technologies Symposium (ESTS),
Shahabi, Ali ; Lemmon, Andrew ; DeBoi, Brian.. - p. 1-7 , 2021
Link: https://doi.org/10.1109/..
 
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6

Modeling and Validation of Medium Voltage SiC Power Modules:

, In: 2020 IEEE Applied Power Electronics Conference and Exposition (APEC),
DeBoi, Brian ; Lemmon, Andrew ; Nelson, Blake.. - p. 1964-1971 , 2020
Link: https://doi.org/10.1109/..
 
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7

Measurement-Based Modeling of Power Module Parasitics with ..:

, In: 2020 IEEE Applied Power Electronics Conference and Exposition (APEC),
Nelson, Blake ; Lemmon, Andrew ; DeBoi, Brian.. - p. 1430-1437 , 2020
Link: https://doi.org/10.1109/..
 
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8

Improved Methodology for Estimating Switching Losses of Wid..:

Bryant, Briana M. ; Lemmon, Andrew N. ; DeBoi, Brian T...
IEEE Transactions on Power Electronics.  39 (2024)  5 - p. 5590-5601 , 2024
Link: https://doi.org/10.1109/..
 
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9

A Simple and Non-Destructive Method to Measure Per-Terminal..:

DeBoi, Brian T. ; Lemmon, Andrew ; Curbow, Austin
IEEE Open Journal of Power Electronics.  4 (2023)  - p. 1041-1049 , 2023
Link: https://doi.org/10.1109/..
 
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10

Comparison of FEA Techniques for Estimation of Power Module..:

, In: 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP),
Lemmon, Andrew N. ; DeBoi, Brian T. - p. 1-7 , 2022
Link: https://doi.org/10.1109/..
 
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11

Improved Methodology for Parasitic Analysis of High-Perform..:

DeBoi, Brian T. ; Lemmon, Andrew N. ; McPherson, Brice.
IEEE Transactions on Power Electronics.  37 (2022)  10 - p. 12415-12425 , 2022
Link: https://doi.org/10.1109/..
 
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12

Sensitivities in High-Bandwidth, High-Current Shunt Measure..:

, In: 2022 IEEE Applied Power Electronics Conference and Exposition (APEC),
New, Christopher D. ; Lemmon, Andrew N. ; DeBoi, Brian T. - p. 1658-1663 , 2022
Link: https://doi.org/10.1109/..
 
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13

Computational Efficiency Analysis of SiC MOSFET Models in S..:

Nelson, Blake W. ; Lemmon, Andrew N. ; Jimenez, Sergio J....
IEEE Open Journal of Power Electronics.  2 (2021)  - p. 106-123 , 2021
Link: https://doi.org/10.1109/..
 
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14

Computational Efficiency Analysis of SiC MOSFET Models in S..:

Nelson, Blake W. ; Lemmon, Andrew N. ; DeBoi, Brian T....
IEEE Open Journal of Power Electronics.  1 (2020)  - p. 499-512 , 2020
Link: https://doi.org/10.1109/..
 
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15

Design and Characterization of a Neutral-Point-Clamped Inve..:

, In: 2020 IEEE Applied Power Electronics Conference and Exposition (APEC),
New, Christopher D. ; Lemmon, Andrew N. ; DeBoi, Brian T.... - p. 2912-2919 , 2020
Link: https://doi.org/10.1109/..
 
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