DeBoi, Brian T.
21  Ergebnisse:
Personensuche X
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1

Improved Methodology for Estimating Switching Losses of Wid..:

Bryant, Briana M. ; Lemmon, Andrew N. ; DeBoi, Brian T...
IEEE Transactions on Power Electronics.  39 (2024)  5 - p. 5590-5601 , 2024
 
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2

A Simple and Non-Destructive Method to Measure Per-Terminal..:

DeBoi, Brian T. ; Lemmon, Andrew ; Curbow, Austin
IEEE Open Journal of Power Electronics.  4 (2023)  - p. 1041-1049 , 2023
 
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3

Comparison of FEA Techniques for Estimation of Power Module..:

, In: 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP),
 
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4

Improved Methodology for Parasitic Analysis of High-Perform..:

DeBoi, Brian T. ; Lemmon, Andrew N. ; McPherson, Brice.
IEEE Transactions on Power Electronics.  37 (2022)  10 - p. 12415-12425 , 2022
 
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5

Sensitivities in High-Bandwidth, High-Current Shunt Measure..:

, In: 2022 IEEE Applied Power Electronics Conference and Exposition (APEC),
 
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7

Computational Efficiency Analysis of SiC MOSFET Models in S..:

Nelson, Blake W. ; Lemmon, Andrew N. ; DeBoi, Brian T....
IEEE Open Journal of Power Electronics.  1 (2020)  - p. 499-512 , 2020
 
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8

Design and Characterization of a Neutral-Point-Clamped Inve..:

, In: 2020 IEEE Applied Power Electronics Conference and Exposition (APEC),
 
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9

Comparison of Medium-Voltage Oscilloscope Probes for Evalua..:

, In: 2020 IEEE Energy Conversion Congress and Exposition (ECCE),
 
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10

Improved Methodology for Parasitic Characterization of High..:

DeBoi, Brian T. ; Lemmon, Andrew N. ; Nelson, Blake W...
IEEE Transactions on Power Electronics.  35 (2020)  12 - p. 13400-13408 , 2020
 
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11

Bus Snubber Optimization for Multi-Chip Power Modules using..:

, In: 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP),
DeBoi, Brian T. ; Lemmon, Andrew N. - p. 125-130 , 2019
 
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15

A Simple and Non-Destructive Method to Measure Per-Terminal..:

, In: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC),
DeBoi, Brian ; Curbow, Austin ; Lemmon, Andrew - p. 1633-1638 , 2023
 
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