Debski, W.
176  Ergebnisse:
Personensuche X
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3

122 GHz ISM-band transceiver concept and silicon ICs for lo..:

, In: 2010 IEEE MTT-S International Microwave Symposium,
Schmalz, K. ; Winkler, W. ; Borngraber, J.... - p. 1-1 , 2010
 
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4

The exceptional earthquakes in Kaliningrad district, Russia..:

Gregersen, S. ; Wiejacz, P. ; Dębski, W....
Physics of the Earth and Planetary Interiors.  164 (2007)  1-2 - p. 63-74 , 2007
 
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6

Enhanced velocity tomography: Practical method of combining..:

Debski, W. ; Young, R. P.
Geophysical Research Letters.  26 (1999)  21 - p. 3253-3256 , 1999
 
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7

Subsets of n with convex midsets:

Dębski, W. ; Kawamura, K. ; Yamada, K.
Topology and its Applications.  60 (1994)  2 - p. 109-115 , 1994
 
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8

External Equivalence Classes in Decompositions of Spaces:

Debski, W. ; Tymchatyn, E. D.
Proceedings of the American Mathematical Society.  100 (1987)  4 - p. 781-784 , 1987
 
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9

Shorter Notes: A Short Proof That a Compact Ordered Space C..:

Bula, W. ; Dębski, W. ; Kulpa, W.
Proceedings of the American Mathematical Society.  82 (1981)  2 - p. 312-313 , 1981
 
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11

The exceptional earthquakes in Kaliningrad district, Russia..:

Gregersen, S ; Wiejacz, P ; Debski, W...
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.pepi.2007.06.005.  , 2007
 
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12

The exceptional earthquakes in kaliningrad district, russia..:

Gregersen, S ; Wiejacz, P ; Dębski, W...
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.pepi.2007.06.005.  , 2007
 
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14

Trigered sub-critical fracturing;Fracturing of sof and flex..:

W. Dȩbski (10022897) ; P. Klejment (10022900)
https://figshare.com/articles/dataset/Trigered_sub-critical_fracturing_Fracturing_of_sof_and_flexible_material_Fracturing_of_strong_and_flexible_material_Super-fiber_resistance_to_breaking_DEM_and_Fiber_Bundle_model_similarity_from_Earthquake_physics_beyond_the_linear_fracture_/13627820.  , 2021
 
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15

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) ..:

Yi, Hengqian ; Ozturk, Efe ; Koelink, Marco...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  6 - p. 893-901 , 2022
 
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